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87639-1110 PDF预览

87639-1110

更新时间: 2024-11-11 06:33:27
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器双倍数据速率
页数 文件大小 规格书
7页 340K
描述
1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.18mm (.125) Tail Length

87639-1110 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:compliant
风险等级:5.84其他特性:LATCHED
连接器类型:CARD EDGE CONNECTOR联系完成配合:GOLD (30)
联系完成终止:Tin (Sn)触点性别:FEMALE
触点材料:PHOSPHOR BRONZEDIN 符合性:NO
滤波功能:NOIEC 符合性:NO
JESD-609代码:e3MIL 符合性:NO
混合触点:NO安装方式:25 DEGREE
安装类型:BOARD装载的行数:2
选件:GENERAL PURPOSE端子节距:1.27 mm
端接类型:SOLDER触点总数:184
UL 易燃性代码:94V-0Base Number Matches:1

87639-1110 数据手册

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This document was generated on 04/09/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0876391001  
Active  
Description:  
1.27mm (.050") Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile,  
Single Key, with Beveled Metal Pins and Plastic Pegs, 2.79mm (.110") Tail Length,  
0.38µm (15µ") Gold (Au) Plating, 184 Circuits, Leadfree  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-87639-002 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
General  
Product Family  
Series  
Component Type  
JEDEC Outline  
Product Name  
EU RoHS  
Memory Module Sockets  
87639  
Memory Module  
MO-206  
DDR DIMM  
Physical  
Circuits (Loaded)  
Color - Resin  
Durability (mating cycles max)  
Entry Angle  
Not Halogen-Free  
Need more information on product  
environmental compliance?  
184  
Black, Natural  
25  
25° Angle  
Email productcompliance@molex.com  
Keying to Mating Part  
Material - Metal  
Yes  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Brass, Phosphor Bronze  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Gold  
Tin  
Please visit the Contact Us section for any  
non-product compliance questions.  
High Temperature Thermoplastic  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
0.110 In  
2.79 mm  
Yes  
Search Parts in this Series  
PCB Retention  
Yes  
87639Series  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.062 In  
1.60 mm  
Tray  
0.050 In  
1.27 mm  
15.2  
0.38  
101.6  
2.54  
-40°C to +85°C  
Through Hole  
Mates With  
JEDEC MO-206 modules  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Temperature Range - Operating  
Termination Interface: Style  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
50V  
2.5V, Right  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
10  
Wave Capable (TH only)  
Max. Cycles at Max. Process Temperature  
Process Temperature max. C  
2
240  
Material Info  
Reference - Drawing Numbers  

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