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853S314AGILFT PDF预览

853S314AGILFT

更新时间: 2024-02-29 16:06:59
品牌 Logo 应用领域
艾迪悌 - IDT 驱动光电二极管逻辑集成电路
页数 文件大小 规格书
16页 177K
描述
Low Skew Clock Driver, 853S Series, 4 True Output(s), 0 Inverted Output(s), PDSO20, 4.40 MM X 6.50 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20

853S314AGILFT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:4.40 MM X 6.50 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-20针数:20
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.84
其他特性:IT ALSO OPERATE ON 3.3V SUPPLY系列:853S
输入调节:DIFFERENTIAL MUXJESD-30 代码:R-PDSO-G20
JESD-609代码:e3长度:6.5 mm
逻辑集成电路类型:LOW SKEW CLOCK DRIVER湿度敏感等级:1
功能数量:1反相输出次数:
端子数量:20实输出次数:4
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP20,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:2.5/3.3 V传播延迟(tpd):0.65 ns
认证状态:Not QualifiedSame Edge Skew-Max(tskwd):0.05 ns
座面最大高度:1.2 mm子类别:Clock Drivers
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:4.4 mm最小 fmax:2700 MHz
Base Number Matches:1

853S314AGILFT 数据手册

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ICS853S314I Data Sheet  
LOW SKEW, 1-TO4 DIFFERENTIAL-TO2.5V, 3.3V LVPECL/ECL FANOUT BUFFER  
TABLE 5. AC CHARACTERISTICS, (LVPECL/HSTL): VCC = 3.3V 5ꢀ OR 2.5V 5ꢀ, VEE = 0V, OR  
(ECL): VEE = -3.3V 5ꢀ OR -2.5V 5ꢀ, VCC = 0V; TA = -40°C TO 85°C  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
VPP  
VCMR  
fCLK  
tPD  
Differential Input Voltage; NOTE 1  
0.15  
1.3  
VCC - 0.3  
2.7  
V
Differential Input Crosspoint Voltage;  
NOTE 2  
V
EE + 1.0  
V
Input Frequency; NOTE 3  
GHz  
ps  
V
Propagation Delay, CLKA or CLKB to  
Output Pair  
280  
0.4  
650  
VDIF  
VX  
HSTL Differential Input Voltage; NOTE 4  
1.0  
HSTL Input Differential Crosspoint  
Voltage; NOTE 5  
V
EE + 0.01  
VCC - 1.0  
V
fO < 300MHz  
fO < 1.5GHz  
0.45  
0.3  
0.72  
0.55  
0.95  
0.95  
50  
V
V
Differential Output Voltage  
(peak-to-peak)  
VO(pp)  
tsk(o)  
Output Skew  
ps  
ps  
tsk(pp)  
Part-to-Part Skew; NOTE 6  
150  
156.25MHz @ 3.3V,  
(1.875MHz - 20MHz)  
312.5MHz @ 3.3V,  
(1.875MHz - 20MHz)  
0.138  
0.092  
ps  
ps  
Buffer Additive Phase Jitter, RMS;  
refer to Additive Phase Jitter  
Section  
tjit  
tsk(p)  
tR / tF  
Output Pulse Skew; NOTE 7  
Output Rise/Fall Time  
660MHz  
75  
ps  
ns  
20ꢀ to 80ꢀ  
0.05  
0.3  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established  
when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet  
specifications after thermal equilibrium has been reached under these conditions.  
AC characteristics apply for parallel output termination of 50Ω to VTT.  
NOTE 1: VPP is the minimum differential ECL/LVPECL input voltage swing required to maintain AC characteristics including  
tPD and device-to-device skew.  
NOTE 2: VCMR is the crosspoint of the differential ECL/LVPECL input signal. Normal AC operation is obtained when the  
crosspoint is within the VCMR range and the input swing lies within the VPP specificatiion. Violation of VCMR or VPP impacts the  
device propagation delay, device and part-to-part skew.  
NOTE 3: The ICS853S314I is fully operational up to 2.7GHz and is characterized up to 1.5GHz.  
NOTE 4:VDIF is the minimum differential HSTL input voltage swing required to maintain AC characteristics including tPD and  
device-to-device skew.  
NOTE 5: VX is the crosspoint of the differential HSTL input signal. Normal AC operation is obtained when the crosspoint is  
within the VX range and the input swing lies within the VDIF specification. Violation of VX or VDIF impacts the device  
propgation delay, device and part-to-part skew.  
NOTE 6: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 7: Output pulse skew is the absolute value of the difference of the propagation delay times:tPLH - tPHL .  
ICS853S314AFI REVISION B OCTOBER 4, 2013  
5
©2013 Integrated Device Technology, Inc.  

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