Datasheet > 835-93-068-10-001

835-93-068-10-001

更新时间： 2024-11-05 17:51:43

品牌	Logo	应用领域
仕元机械 - MILL-MAX		连接器
页数	文件大小	规格书
2页	245K
描述
Board Connector, 68 Contact(s), 2 Row(s), Female, Straight, Solder Terminal

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

835-93-068-10-001 技术参数

生命周期：	Obsolete	Reach Compliance Code：	unknown
风险等级：	5.84	其他特性：	OFP, LOW PROFILE
连接器类型：	BOARD CONNECTOR	触点性别：	FEMALE
滤波功能：	NO	混合触点：	NO
安装方式：	STRAIGHT	安装类型：	BOARD
装载的行数：	2	端子节距：	2.54 mm
端接类型：	SOLDER	触点总数：	68
Base Number Matches：	1

835-93-068-10-001 数据手册

浏览型号835-93-068-10-001的Datasheet PDF文件第2页

INTERCONNECTS

OFP Pass Thru Sockets for Ø.030” & .025” pins

Single and Double Row

Series 834, 835

ꢀ

• 834/835 Series Pass Thru Sockets have a low

.130” profile and will accept Ø.030” round pin,

as well as industry standard .025” square pin

headers.

• They are typically used to interconnect two or

more parallel circuit boards.

• Sockets are designed for hand, wave or reflow*

soldering. The high temp. insulator is compati-

ble with all solder processes.

• Unique ORGANIC FIBRE PLUG barriers pre-

vent solder, paste or flux from contaminating

the internal spring contacts. After soldering, the

OFP barriers are pushed out of the socket

when the mating header is inserted.

• Mill-Max sockets use a precision machined

brass sleeve with a press-fit beryllium copper

“multi-finger” spring contact.

Typical Application

500%2

#)2#5)4

"/!2$

).4%2ꢆ#/..%#4)/.

0).

• Recommended mounting holes are Ø.046

ꢀꢁꢂꢁꢃ OR

ꢀꢀꢁꢄꢅꢃ 0).3

.003” PTH (1,2 mm drilled prior to plating).

ꢇꢈꢉ 302).'

#/.4!#4

*Intrusive reflow (also called "pin-in-paste") is a tech-

nique of using conventional thru-hole components

in a reflow soldering process. The pass thru socket

is placed into plated-thru-holes in the circuit board

(solder paste has previously been screen printed on

pads adjacent to the holes) and the board is

-)$$,%

#)2#5)4

"/!2$

3/#+%4

).35,!4/2

0!33 4(25

3/#+%43

3/#+%4

3,%%6%

reflowed in the same pass as other SMT compo-

nents. Solder will fill the plated-thru-holes and

achieve solder joints as reliable as wave soldering.

#)2#5)4

"/!2$

,/7%2

#)2#5)4

"/!2$

The OFP barrier prevents solder paste from being

picked-up inside the contact during assembly.

/2'!.)# &)"%2 0,5'

3/,$%2

*/).4

053(%$ /54 "9 ).4%2ꢆ#/..%#4

0). !&4%2 3/,$%2).'

Patent Pending

Ordering Information

Single Row OFP Pass Thru Socket

834-XX-0 _ _-10-001

Fig. 1

Fig. 2

Specify # of pins

01-64

Fig. 1

Double Row OFP Pass Thru Socket

835-XX-0 _ _-10-001

Specify # of pins

02-72

XX= Plating Code

See Below

SPECIFY PLATING CODE XX=

200μ” Sn/Pb 200μ”Sn/Pb

30μ” Au 200μ”Sn/Pb

Sleeve (Pin)

Fig. 2

Contact (Clip)

www.mill-max.com

ꢀ

516-922-6000

(6/04 - 550, 547, 535, 529)

中文翻译

下载PDF

与835-93-068-10-001相关器件

型号	品牌	获取价格	描述	数据表
835-93-068-10-001000	MILL-MAX	获取价格	Board Connector, 68 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket,
835-93-069-10-001	MILL-MAX	获取价格	Board Connector
835-93-070-10-001	MILL-MAX	获取价格	Board Connector, 70 Contact(s), 2 Row(s), Female, Straight, Solder Terminal
835-93-071-10-001	MILL-MAX	获取价格	Board Connector
835-93-072-10-001000	MILL-MAX	获取价格	Board Connector, 72 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket,
83594	MOLEX	获取价格	Conductor Anvil
83596-001	AMPHENOL	获取价格	Interconnection Device
83596-002	AMPHENOL	获取价格	Interconnection Device
83596-003	AMPHENOL	获取价格	Interconnection Device
83596-004	AMPHENOL	获取价格	Interconnection Device

与835-93-068-10-001相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

13
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

9
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

35
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

31

产品中心

服务支持

精选活动

关于我们

帮助中心

835-93-068-10-001

835-93-068-10-001 技术参数

835-93-068-10-001 数据手册

与835-93-068-10-001相关器件

与835-93-068-10-001相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

835-93-068-10-001

835-93-068-10-001 技术参数

835-93-068-10-001 数据手册

与835-93-068-10-001相关器件

与835-93-068-10-001相关文章

您还可以找

您在本页遇到什么问题？