Datasheet > 835-93-072-10-001000

835-93-072-10-001000

更新时间： 2024-11-05 18:55:59

品牌	Logo	应用领域
仕元机械 - MILL-MAX		连接器
页数	文件大小	规格书
1页	452K
描述
Board Connector, 72 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket,

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技术参数
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835-93-072-10-001000 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	Reach Compliance Code：	compliant
风险等级：	5.41	主体/外壳类型：	SOCKET
连接器类型：	BOARD CONNECTOR	联系完成配合：	GOLD (30) OVER NICKEL (100)
联系完成终止：	TIN LEAD (200) OVER NICKEL (150)	触点性别：	FEMALE
触点材料：	NOT SPECIFIED	DIN 符合性：	NO
滤波功能：	NO	IEC 符合性：	NO
JESD-609代码：	e0	MIL 符合性：	NO
混合触点：	NO	安装方式：	STRAIGHT
安装类型：	BOARD	装载的行数：	2
选件：	GENERAL PURPOSE	端子节距：	2.54 mm
端接类型：	SOLDER	触点总数：	72
Base Number Matches：	1

835-93-072-10-001000 数据手册

INTERCONNECTS

SERIES 834 & 835 • .100” GRID OFP PASS THROUGH SOCKETS

Ø.030” & .025” PINS• SINGLE AND DOUBLE ROW STRIPS

• 834/835 Series Pass-Through Sockets have a low

.130”proꢁle and will accept Ø.030”round pin,

as well as industry standard .025”square pin

headers.

• They are typically used to interconnect two or

more parallel circuit boards.

• Sockets are designed for hand, wave or reꢂow*

soldering. The high temperature insulator is

compatible with all solder processes.

• Unique ORGANIC FIBRE PLUG® barriers prevent

solder, paste or ꢂux from contaminating the

internal spring contacts. After soldering, the

OFP® barriers are pushed out of the socket when

the mating header is inserted.

UPPER

CIRCUIT

BOARD

Typical Application

INTERCONNECTION

• Mill-Max sockets use a receptacle consisting of a

precision-machined brass sleeve with a press-ꢁt

beryllium copper“multi-ꢁnger”spring contact.

Ø.030" or

.025" PINS

#47 SPRING

CONTACT

MIDDLE

CIRCUIT

BOARD

• Recommended mounting holes are Ø.046 .003”

PTH (1,2 mm drilled prior to plating).

SOCKET

INSULATOR

*Intrusive reﬂow (also called “pin-in-paste”) is a technique

of using conventional through-hole components in a

reﬂow soldering process. The pass-through socket is placed

into plated through-holes in the circuit board (solder paste

has previously been screen printed on pads adjacent to the

holes) and the board is reﬂowed in the same pass as other

SMT components. Solder will ﬁll the plated through-holes

and achieve solder joints as reliable as wave soldering. The

OFP® barrier prevents solder paste from being picked up

inside the contact during assembly.

PASS THROUGH

SOCKETS

RECEPTACLE

SLEEVE

CIRCUIT

BOARD

LOWER

CIRCUIT

BOARD

ORGANIC FIBER PLUG

SOLDER

JOINT

PUSHED OUT BY INTERCONNECT

PIN AFTER SOLDERING

.025-.036

.025 .025

US Patent #7,086,870

Number of Pins

X .100"

.100

ORDERING INFORMATION

Series 834...001 Single Row OFP® Pass-Through Socket

834ꢀXXꢀ0 _ _ꢀ10ꢀ001000

.088

.110

.130

.080

.061 DIA.

.043 DIA.

FIG. 1

FIG. 2

.036 DIA.

Through-Hole

Specify number of pins

01-64

.100

Series 835...001 Double Row OFP® Pass-Through Socket

FIG. 1

835ꢀXXꢀ0 _ _ꢀ10ꢀ001000

.025-.036

.025 .025

Number of Pins

X .100" / 2

.200

Specify number of pins

04-72

For

.088

.110

.130

.080

Electrical, Mechanical

& Enviromental Data,

See page 264

RoHS-2

XX=Plating Code

See Below

2011/65/EU

.061 DIA.

.043 DIA.

.036 DIA.

Through-Hole

SPECIFY PLATING CODE XX=

Sleeve (Pin)

.100

200 µ”Sn/Pb

200 µ” Sn 200 µ” Sn

30 µ” Au

30 µ” Au Au Flash

FIG. 2

Contact (Clip)

Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com

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