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835-93-042-10-001000

更新时间： 2024-11-05 18:55:59
品牌 Logo 应用领域
仕元机械 - MILL-MAX 连接器
页数 文件大小 规格书
1页 452K
描述
Board Connector, 42 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket,

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835-93-042-10-001000 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：ActiveReach Compliance Code：compliant
风险等级：5.41主体/外壳类型：SOCKET
连接器类型：BOARD CONNECTOR联系完成配合：GOLD (30) OVER NICKEL (100)
联系完成终止：TIN LEAD (200) OVER NICKEL (150)触点性别：FEMALE
触点材料：NOT SPECIFIEDDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e0MIL 符合性：NO
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：2
选件：GENERAL PURPOSE端子节距：2.54 mm
端接类型：SOLDER触点总数：42
Base Number Matches：1

835-93-042-10-001000 数据手册

  
INTERCONNECTS  
®
-
SERIES 834 & 835 • .100” GRID OFP PASS THROUGH SOCKETS  
Ø.030” & .025” PINS• SINGLE AND DOUBLE ROW STRIPS  
• 834/835 Series Pass-Through Sockets have a low  
.130”proꢁle and will accept Ø.030”round pin,  
as well as industry standard .025”square pin  
headers.  
• They are typically used to interconnect two or  
more parallel circuit boards.  
• Sockets are designed for hand, wave or reꢂow*  
soldering. The high temperature insulator is  
compatible with all solder processes.  
• Unique ORGANIC FIBRE PLUG® barriers prevent  
solder, paste or ꢂux from contaminating the  
internal spring contacts. After soldering, the  
OFP® barriers are pushed out of the socket when  
the mating header is inserted.  
UPPER  
CIRCUIT  
BOARD  
Typical Application  
INTERCONNECTION  
PIN  
• Mill-Max sockets use a receptacle consisting of a  
precision-machined brass sleeve with a press-ꢁt  
beryllium copper“multi-ꢁnger”spring contact.  
Ø.030" or  
.025" PINS  
#47 SPRING  
CONTACT  
MIDDLE  
CIRCUIT  
BOARD  
• Recommended mounting holes are Ø.046 .003”  
PTH (1,2 mm drilled prior to plating).  
SOCKET  
INSULATOR  
*Intrusive reflow (also called “pin-in-paste”) is a technique  
of using conventional through-hole components in a  
reflow soldering process. The pass-through socket is placed  
into plated through-holes in the circuit board (solder paste  
has previously been screen printed on pads adjacent to the  
holes) and the board is reflowed in the same pass as other  
SMT components. Solder will fill the plated through-holes  
and achieve solder joints as reliable as wave soldering. The  
OFP® barrier prevents solder paste from being picked up  
inside the contact during assembly.  
PASS THROUGH  
SOCKETS  
RECEPTACLE  
SLEEVE  
CIRCUIT  
BOARD  
LOWER  
CIRCUIT  
BOARD  
®
ORGANIC FIBER PLUG  
SOLDER  
JOINT  
PUSHED OUT BY INTERCONNECT  
PIN AFTER SOLDERING  
.025-.036  
.025 .025  
*
US Patent #7,086,870  
Number of Pins  
X .100"  
.100  
ORDERING INFORMATION  
Series 834...001 Single Row OFP® Pass-Through Socket  
834ꢀXXꢀ0 _ _ꢀ10ꢀ001000  
.088  
.110  
.130  
.080  
.061 DIA.  
.043 DIA.  
FIG. 1  
FIG. 2  
.036 DIA.  
Through-Hole  
Specify number of pins  
01-64  
®
.100  
Series 835...001 Double Row OFP® Pass-Through Socket  
FIG. 1  
835ꢀXXꢀ0 _ _ꢀ10ꢀ001000  
.025-.036  
.025 .025  
*
Number of Pins  
X .100" / 2  
.200  
Specify number of pins  
04-72  
For  
.088  
.110  
.130  
.080  
Electrical, Mechanical  
& Enviromental Data,  
See page 264  
RoHS-2  
XX=Plating Code  
See Below  
2011/65/EU  
.061 DIA.  
.043 DIA.  
.036 DIA.  
Through-Hole  
93  
43  
47  
SPECIFY PLATING CODE XX=  
Sleeve (Pin)  
.100  
®
.100  
200 µ”Sn/Pb  
200 µ” Sn 200 µ” Sn  
30 µ” Au  
30 µ” Au Au Flash  
FIG. 2  
Contact (Clip)  
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com  
1

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