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8304AMILF PDF预览

8304AMILF

更新时间: 2024-11-25 01:22:51
品牌 Logo 应用领域
艾迪悌 - IDT 驱动光电二极管逻辑集成电路
页数 文件大小 规格书
11页 195K
描述
Low Skew, 1-to-4 LVCMOS/LVTTL

8304AMILF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Lifetime Buy零件包装代码:SOIC
包装说明:3.80 X 4.80 MM, 1.47 MM HEIGHT, ROHS COMPLIANT, MS-012, SOIC-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.44
系列:8304输入调节:STANDARD
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:4.9 mm逻辑集成电路类型:LOW SKEW CLOCK DRIVER
最大I(ol):0.016 A湿度敏感等级:1
功能数量:1反相输出次数:
端子数量:8实输出次数:4
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:3.7 ns
传播延迟(tpd):3.7 ns认证状态:Not Qualified
Same Edge Skew-Max(tskwd):0.06 ns座面最大高度:1.75 mm
子类别:Clock Drivers最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:3.9 mm
Base Number Matches:1

8304AMILF 数据手册

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Low Skew, 1-to-4 LVCMOS/LVTTL  
Fanout Buffer  
8304I  
Data Sheet  
GENERAL DESCRIPTION  
FEATURES  
The 8304I is a low skew, 1-to-4 Fanout Buffer.The 8304I is charac-  
terized at full 3.3V for input V , and mixed 3.3V and 2.5V for output  
Four LVCMOS / LVTTL outputs  
LVCMOS clock input  
operating supply modes (V D)D. Guaranteed output and part-to-part  
DDO  
skew characteristics make the 8304I ideal for those clock distribution  
applications demanding well defined performance and repeatability.  
CLK can accept the following input levels: LVCMOS, LVTTL  
Maximum output frequency: 166MHz  
Output skew: 60ps (maximum)  
Part-to-part skew: 650ps (maximum)  
Small 8 lead SOIC package saves board space  
3.3V input, outputs may be either 3.3V or 2.5V supply modes  
-40°C to 85°C ambient operating temperature  
Available in lead-free (RoHS 6) compliant package  
BLOCK DIAGRAM  
PIN ASSIGNMENT  
Q0  
VDDO  
VDD  
Q3  
Q2  
Q1  
Q0  
1
2
3
4
8
7
6
5
Q1  
CLK  
GND  
Pulldown  
CLK  
Q2  
Q3  
8304I  
8-Lead SOIC  
3.8mm x 4.8mm, x 1.47mm package body  
M Package  
Top View  
©2015 Integrated Device Technology, Inc  
1
December 10, 2015  

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