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75908-0002 PDF预览

75908-0002

更新时间: 2024-11-05 06:32:03
品牌 Logo 应用领域
莫仕 - MOLEX 连接器
页数 文件大小 规格书
2页 179K
描述
0.75mm (.030”) Pitch AMC.0 B+ 170-Circuit Connectors

75908-0002 数据手册

 浏览型号75908-0002的Datasheet PDF文件第2页 
0.75mm (.030”) Pitch  
AMC.0 B+  
170-Circuit Connectors  
FEATURES AND SPECIFICATIONS  
AMC.0 B+ connectors from Molex support the next generation of mezzanine card standards and  
12.5 Gbps speeds  
75800 Standard  
75908 Pegless  
The 170-circuit AMC.0 B+, or AdvancedMCTM  
footprint further reduces crosstalk by managing  
connectors from Molex support the next generation of  
mezzanine card standards that allow for hot-plugging  
of high-speed serial interconnects. These connectors  
support AdvancedTCA (Advanced Telecommunications  
Computing Architecture), a standard developed by  
PICMG (PCI Industrial Computer Manufacturers Group).  
inter-pair affinity and incorporating additional ground  
vias for isolation. As a result, the AMC.0 B+ connectors  
achieve crosstalk of less than 3 percent at 12.5 Gbps.  
75791 Extended Height  
Three versions of the Molex AMC.0 B+ connector  
exist: the standard connector with locating pegs (series  
75800), connector without pegs (series 75908) and  
the 1.15mm (.045”) extended-height connector (series  
75791). This taller height is optimized for blade-server  
Molex AMC.0 B+ connectors feature controlled  
impedance and reduced crosstalk, plus a footprint  
launch optimized for high-speed data rates. This design applications where cooling is critical.  
enables the connector to achieve 12.5 Gbps NRZ (Non  
Return to Zero) signal transmission. This enhanced  
Series 75800 Standard AMC.0 B+ Connector  
Features and Benefits  
n Insert-molded wafer design provides excellent  
n Tin or Tin-Lead tail plating supports RoHS  
requirements and customer preferences for  
press-fit  
electrical performance  
n Press-fit contacts and high-speed footprint for  
simpler application to PCB and superior signal  
integrity than competition  
n Meets PICMG Advanced MCTM specification and  
industry standard requirements  
SPECIFICATIONS  
Reference Information  
Packaging: Tray  
UL File No.: E29179  
CSA File No.: LR19980  
Mates With: AMC module  
Designed In: Millimeters  
Mechanical  
Insertion Force to PCB: 6050N (1360 lbf) max.  
Mating Force: 100N (22 lbf) max.  
Unmating Force: 65N (14 lbf) max.  
Durability: 200 cycles  
Physical  
Electrical  
Voltage: 250V AC  
Housing: Black Thermoplastic  
Contact: Copper (Cu) Alloy  
Plating:  
Contact Area — 0.76μm Gold (Au)  
Solder Tail Area — Tin or Tin-Lead (Sn or Sn/Pb)  
Underplating — Nickel (Ni)  
PCB Thickness: 2.36mm (.092”)  
Operating Temperature: -40 to +105ºC  
Current: 1.5A Power Terminal  
1.0A Other Terminals  
Contact Resistance: 60 milliohms max.  
Dielectric Withstanding Voltage: 80V RMS  
Insulation Resistance: 500V DC  

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