Datasheet > 75908-0002

75908-0002

更新时间： 2024-11-07 06:32:03

品牌	Logo	应用领域
莫仕 - MOLEX		连接器
页数	文件大小	规格书
2页	179K
描述
0.75mm (.030”) Pitch AMC.0 B+ 170-Circuit Connectors

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75908-0002 数据手册

0.75mm (.030”) Pitch

AMC.0 B+

170-Circuit Connectors

FEATURES AND SPECIFICATIONS

AMC.0 B+ connectors from Molex support the next generation of mezzanine card standards and

12.5 Gbps speeds

75800 Standard

75908 Pegless

The 170-circuit AMC.0 B+, or AdvancedMC^TM

footprint further reduces crosstalk by managing

connectors from Molex support the next generation of

mezzanine card standards that allow for hot-plugging

of high-speed serial interconnects. These connectors

support AdvancedTCA (Advanced Telecommunications

Computing Architecture), a standard developed by

PICMG (PCI Industrial Computer Manufacturers Group).

inter-pair afﬁnity and incorporating additional ground

vias for isolation. As a result, the AMC.0 B+ connectors

achieve crosstalk of less than 3 percent at 12.5 Gbps.

75791 Extended Height

Three versions of the Molex AMC.0 B+ connector

exist: the standard connector with locating pegs (series

75800), connector without pegs (series 75908) and

the 1.15mm (.045”) extended-height connector (series

75791). This taller height is optimized for blade-server

Molex AMC.0 B+ connectors feature controlled

impedance and reduced crosstalk, plus a footprint

launch optimized for high-speed data rates. This design applications where cooling is critical.

enables the connector to achieve 12.5 Gbps NRZ (Non

Return to Zero) signal transmission. This enhanced

Series 75800 Standard AMC.0 B+ Connector

Features and Beneﬁts

n Insert-molded wafer design provides excellent

n Tin or Tin-Lead tail plating supports RoHS

requirements and customer preferences for

press-ﬁt

electrical performance

n Press-ﬁt contacts and high-speed footprint for

simpler application to PCB and superior signal

integrity than competition

n Meets PICMG Advanced MC^TMspeciﬁcation and

industry standard requirements

SPECIFICATIONS

Reference Information

Packaging: Tray

UL File No.: E29179

CSA File No.: LR19980

Mates With: AMC module

Designed In: Millimeters

Mechanical

Insertion Force to PCB: 6050N (1360 lbf) max.

Mating Force: 100N (22 lbf) max.

Unmating Force: 65N (14 lbf) max.

Durability: 200 cycles

Physical

Electrical

Voltage: 250V AC

Housing: Black Thermoplastic

Contact: Copper (Cu) Alloy

Plating:

Contact Area — 0.76μm Gold (Au)

Solder Tail Area — Tin or Tin-Lead (Sn or Sn/Pb)

Underplating — Nickel (Ni)

PCB Thickness: 2.36mm (.092”)

Operating Temperature: -40 to +105ºC

Current: 1.5A Power Terminal

1.0A Other Terminals

Contact Resistance: 60 milliohms max.

Dielectric Withstanding Voltage: 80V RMS

Insulation Resistance: 500V DC

中文翻译

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