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75003-0308 PDF预览

75003-0308

更新时间: 2024-02-26 22:20:28
品牌 Logo 应用领域
MOLEXKITS 连接器PC
页数 文件大小 规格书
6页 41K
描述
Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm

75003-0308 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:ActiveReach Compliance Code:unknown
风险等级:5.72Is Samacsys:N
其他特性:ROHS COMPLIANT,TUBE PACKAGING板上安装选件:PEG
主体深度:0.443 inch主体长度:0.785 inch
主体/外壳类型:PLUG连接器类型:BOARD STACKING CONNECTOR
联系完成配合:GOLD (30)联系完成终止:TIN (150)
触点性别:FEMALE触点材料:NOT SPECIFIED
触点模式:RECTANGULAR触点电阻:25 m Ω
触点样式:SQ PIN-SKT介电耐压:500VAC V
耐用性:25 Cycles绝缘电阻:1000000000 Ω
绝缘体颜色:NATURAL绝缘体材料:LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码:e3插接触点节距:0.047 inch
安装选项1:LOCKING安装方式:STRAIGHT
安装类型:BOARD连接器数:ONE
PCB行数:2装载的行数:2
最高工作温度:85 °C最低工作温度:-20 °C
PCB接触模式:RECTANGULARPCB触点行间距:5.6896 mm
电镀厚度:30u inch极化密钥:ENDS
额定电流(信号):1.5 A参考标准:UL, CSA
可靠性:COMMERCIAL子类别:Headers and Edge Type Connectors
端子节距:1.1938 mm端接类型:SURFACE MOUNT
触点总数:12Base Number Matches:1

75003-0308 数据手册

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1801 Morgan Street  
Rockford, Illinois 61102  
800-435-2931  
www.molexkits.com  
Datasheet for 76650-0192  
General Information  
Part Number:  
76650-0192  
Manufacturer:  
Title:  
Molex / Waldom  
Deluxe Board Stacking Application Kit  
Includes KK100, HDM, EBBI 50D, SEARAY, Plateau HS Mezz, IEEE1386,  
SlimStack Product Families. Pitches range: 0.635mm (.025)" - 2.54mm (0.1)"  
Mezzanine IEEE 1386, HDM®**, SlimStack™, KK® 100, EBBI™ 50D, Plateau HS  
Mezz™, and SEARAY*  
Description:  
Product Family:  
Certificates:  
(Molex Parts within this kit) - EU RoHS and RoHS by Exempt Compliant  
Country of Origin: Kit assembled in U.S.A.  
Specifications  
Design  
Configuration:  
Board-to-Board  
0.635mm (.025"), 1.0mm (.039"), 1.20mm (.047"), 1.27mm (.050"), [1.27mm  
(.050")]sq. , 2mm (.079"), and 2.54mm (.100")  
Pitch:  
Connector Type:  
Circuit Sizes:  
Current Rating:  
Voltage:  
Receptacles and Headers/Plugs  
2, 3, 4, 6, 8, 12, 20, 50, 64, 72 and 200  
0.5, 1.0, 1.5, 2.5 and 4 Amps  
30, 100 and 240 Volts  
Product Highlights  
The SEARAY board-to-board connector is designed for computer, networking,  
telecom, storage and general market applications with high pin-count devices or  
memory modules that are mounted on mezzanine or module PC Boards (PCBs).  
The design of our SEARAY has superior electrical and mechanical features that are  
cost competitive. The unique, Molex-patented, solder charge technology results in  
better process yields and a lower applied cost versus equivalent BGA connector  
products. Circuit sizes range from 160 through 500 positions, and mated stack  
heights cover 7mm (.276") to 13mm (.512").  
Molex's SlimStack connectors are tested to accommodate frequency rates up to 3  
GHz for various high-speed applications. With a broad range of circuit sizes and  
stack heights, SlimStack offers an economical way to achieve high-speed  
performance in both 50 and 100 Ohm systems.  
Utilizes proprietary Plateau Technology™ (plated gold housing) to provide a high-  
speed high-density mezzanine connector system for differential and single-ended  
signal applications. The gold-plated plastic shields each differential pair from neigh-  
boring pairs, lowering crosstalk and improving signal clarity. Different stack heights  
and circuit sizes provide flexibility in design and grounding the conductive housing  
eliminates the need for individual ground pin designations within the connector.  
* SEARAY is a trademark of Samtec, Inc.  
** HDM® is a registered trademark of Amphenol Corporation  
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com  
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