Datasheet > 75005-0104

75005-0104

更新时间： 2024-01-07 10:59:35

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
2页	692K
描述
High Speed Mezzanine for 10.0 Gbps Bandwidth

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技术参数
数据手册

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75005-0104 技术参数

是否无铅：	不含铅	生命周期：	Active
Reach Compliance Code：	unknown	Factory Lead Time：	12 weeks
风险等级：	2.23	Samacsys Description：	Molex PLATEAU HS MEZZ Series 1.2mm 48 Way 2 Row Straight PCB Socket Surface Mount Board to Board
连接器类型：	BOARD STACKING CONNECTOR	联系完成配合：	NOT SPECIFIED
联系完成终止：	NOT SPECIFIED	触点材料：	NOT SPECIFIED

75005-0104 数据手册

Plateau HS Mezz™

High Speed Mezzanine for

10.0 Gbps Bandwidth

75003, 75005

High Speed Mezzanine Connectors Feature

Innovative Plated Plastic Housing for

Outstanding Performance

Molex utilizes its proprietary Plateau Technology™ to

create a high-speed, superior performance surface-

mounted mezzanine connector system. This technology

permits the customer to use a smaller footprint

connector than other typical designs, translating into

savings on circuit count and board space.

The shielding properties of the plated housing

effectively isolate each differential pair, eliminating the

need to use signal pins for ground.

These mezzanine connectors are ideal for servers,

mainframe computers, workstations, test equipment

and telecommunications equipment such as switches

and routers.

Features and Beneﬁts

■ Advanced gold-plated plastic housings with

integrated shielding system support high-speed

differential signaling in excess of 10.0 Gbps

■ Impedance of 100 ± 10 ohms at 50 psec risetime

(10/90%) maintained for all stack heights to

ensure very low crosstalk between signals

■ Contacts on 1.20mm (.047”) pitch arranged in

isolated differential pairs on 3.50mm (.138”) pitch

for controlled impedance

■ Two points of contact on each signal ensure high

reliability

■ Available in 6, 12, 24 and 36 differential pair sizes

(12, 24, 48 and 72 total contacts) to accommodate

a range of applications

■ Multiple stack heights from 9.00 to 23.00mm

(.354 to .906”) to meet nearly every parallel

board requirement, with capability up to 25.00mm

(.984”)

■ Molded and plated housing pegs facilitate

attachment to PCB ground plane

SPECIFICATIONS

Reference Information

Packaging: Tape and Reel or Tube

Designed In: Millimeters

UL File No.: E29179

Electrical

Physical

Voltage: 30V DC

Housing: LCP

Current: 1.5A max.

Contact: Copper Alloy

Contact Resistance: 25 milliohms

Dielectric Withstanding Voltage: 500V

Insulation Resistance: 1,000 Megohms

Impedance: 100 +/- 10 Ohms @ 50psec risetime

Plating: Contact Area – 0.76µm (30µ”) min. select

Gold and 3.81µm (150µ”) min. select Tin/Lead

over 1.27µm (50µ”) min. Nickel overall

Housing – 0.10µm (4µ”) max. Gold over 3.81µm

(150µ”) min. Nickel over 3.81µm (150µ”) min.

Copper

CSA File No.: LR19980

Mechanical

Mating Force: 2.0N (.45lb) max. per circuit

Unmating Force: 0.9N (.20lb) min. per circuit

Durability: 25 cycles

Operating Temperature: -20 to +85°C

SMT Lead Coplanarity: 0.102mm (.004”)

中文翻译

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与75005-0104相关器件

型号	品牌	获取价格	描述	数据表
75005-0106	MOLEX	获取价格	High Speed Mezzanine for 10.0 Gbps Bandwidth
75005-0114	MOLEX	获取价格	High Speed Mezzanine for 10.0 Gbps Bandwidth
750050204	MOLEX	获取价格	SALES DRAWING FOR HIGH SPEED MEZZANINE RECEPTACLE
75005-0204	MOLEX	获取价格	High Speed Mezzanine for 10.0 Gbps Bandwidth
75005-0206	MOLEX	获取价格	High Speed Mezzanine for 10.0 Gbps Bandwidth
750050214	MOLEX	获取价格	SALES DRAWING FOR HIGH SPEED MEZZANINE RECEPTACLE
75005-0214	MOLEX	获取价格	High Speed Mezzanine for 10.0 Gbps Bandwidth
750050304	MOLEX	获取价格	SALES DRAWING FOR HIGH SPEED MEZZANINE RECEPTACLE
75005-0304	MOLEX	获取价格	High Speed Mezzanine for 10.0 Gbps Bandwidth
75005-0304	MOLEXKITS	获取价格	Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. P

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