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75003-0X08 PDF预览

75003-0X08

更新时间: 2024-09-25 06:31:55
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莫仕 - MOLEX /
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2页 606K
描述
Combination High Speed Mezzanine

75003-0X08 数据手册

 浏览型号75003-0X08的Datasheet PDF文件第2页 
Combination High Speed  
Mezzanine  
FEATURES AND SPECIFICATIONS  
1.20mm (.047") Pitch  
Plateau HS Mezz™  
Combining Plateau HS Mezz and SlimStack stacking connectors optimizes performance  
and cost for high circuit count applications  
Molex offers a significant cost reduction over  
competing products for high-circuit count board-to-  
board applications with the Combination High Speed  
Mezzanine solutions. Achieve superior electrical  
performance and signal speeds up to 10Gbps and  
beyond utilizing the differential-pair design of the  
Plateau HS Mezz system. At the same time, double up  
on circuit density and cost savings with the SlimStack  
family of mezzanine-style connectors for single-ended  
speeds up to 3Gbps.  
Combinations of mated heights from 10.00 to  
15.00mm (.354 to .591”) and packaging styles are  
also available, including tubes and embossed tape with  
or without pick-and-place covers.  
High Speed Mezzanine  
0.635mm (.025") Pitch  
SlimStack™ SMT Stacking  
Board-to-Board  
Plateau HS Mezz and SlimStack are well suited to work  
in tandem for a range of mezzanine applications.  
Connector designs provide generous lead-ins, allowing  
for maximum processing and mismating tolerances.  
Features and Benefits  
Plateau HS Mezz  
Advanced gold-plated plastic housings with  
integrated shielding system support high-speed  
differential signaling in excess of 10Gbps  
Mezzanine card with HS Mezz and SlimStack for a cost effective solution using high-speed and  
lower-speed requirements.  
Contacts on 1.20mm (.047”) centerline pitch  
arranged in isolated differential pairs on 3.50mm  
(.138”) pitch for controlled impedance  
Multiple stack heights from 10.00 to 25.00mm  
(.394 to .984”) with circuit size ranging from 6 to  
36 pairs (12 to 72 circuits)  
SlimStack  
Contacts on 0.635mm (.025”) centerline pitch  
support single-ended signal speeds up to 3Gbps  
Gold plated contacts with wide-angled mating  
surfaces to minimize risk of damage during mating  
Multiple stack heights from 6.00 to 16.00mm  
(.236” to .630”) with circuit sizes ranging from 20  
to 240 circuits for high-density design flexibility  
SlimStack  
Plateau HS Mezz  
Combination High Speed Mezzanine arrangement absorbs up to 0.1mm in mis-alignment in X and  
Y axis when 2 mating pairs are used.  
APPLICATIONS  
Switches and Hubs  
Routers  
Workstations  
Storage Devices  
Servers and Blade Servers  

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