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75003-0308 PDF预览

75003-0308

更新时间： 2024-02-08 04:27:03
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器PC
页数 文件大小 规格书
2页 692K
描述
High Speed Mezzanine for 10.0 Gbps Bandwidth

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中文翻译

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75003-0308 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：ActiveReach Compliance Code：unknown
风险等级：5.72Is Samacsys：N
其他特性：ROHS COMPLIANT,TUBE PACKAGING板上安装选件：PEG
主体深度：0.443 inch主体长度：0.785 inch
主体/外壳类型：PLUG连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD (30)联系完成终止：TIN (150)
触点性别：FEMALE触点材料：NOT SPECIFIED
触点模式：RECTANGULAR触点电阻：25 m Ω
触点样式：SQ PIN-SKT介电耐压：500VAC V
耐用性：25 Cycles绝缘电阻：1000000000 Ω
绝缘体颜色：NATURAL绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码：e3插接触点节距：0.047 inch
安装选项1：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：2装载的行数：2
最高工作温度：85 °C最低工作温度：-20 °C
PCB接触模式：RECTANGULARPCB触点行间距：5.6896 mm
电镀厚度：30u inch极化密钥：ENDS
额定电流（信号）：1.5 A参考标准：UL, CSA
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子节距：1.1938 mm端接类型：SURFACE MOUNT
触点总数：12Base Number Matches：1

75003-0308 数据手册

 浏览型号75003-0308的Datasheet PDF文件第2页 
Plateau HS Mezz™  
High Speed Mezzanine for  
10.0 Gbps Bandwidth  
75003, 75005  
High Speed Mezzanine Connectors Feature  
Innovative Plated Plastic Housing for  
Outstanding Performance  
Molex utilizes its proprietary Plateau Technology™ to  
create a high-speed, superior performance surface-  
mounted mezzanine connector system. This technology  
permits the customer to use a smaller footprint  
connector than other typical designs, translating into  
savings on circuit count and board space.  
The shielding properties of the plated housing  
effectively isolate each differential pair, eliminating the  
need to use signal pins for ground.  
These mezzanine connectors are ideal for servers,  
mainframe computers, workstations, test equipment  
and telecommunications equipment such as switches  
and routers.  
Features and Benefits  
■ Advanced gold-plated plastic housings with  
integrated shielding system support high-speed  
differential signaling in excess of 10.0 Gbps  
■ Impedance of 100 ± 10 ohms at 50 psec risetime  
(10/90%) maintained for all stack heights to  
ensure very low crosstalk between signals  
■ Contacts on 1.20mm (.047”) pitch arranged in  
isolated differential pairs on 3.50mm (.138”) pitch  
for controlled impedance  
■ Two points of contact on each signal ensure high  
reliability  
■ Available in 6, 12, 24 and 36 differential pair sizes  
(12, 24, 48 and 72 total contacts) to accommodate  
a range of applications  
■ Multiple stack heights from 9.00 to 23.00mm  
(.354 to .906”) to meet nearly every parallel  
board requirement, with capability up to 25.00mm  
(.984”)  
■ Molded and plated housing pegs facilitate  
attachment to PCB ground plane  
SPECIFICATIONS  
Reference Information  
Packaging: Tape and Reel or Tube  
Designed In: Millimeters  
UL File No.: E29179  
Electrical  
Physical  
Voltage: 30V DC  
Housing: LCP  
Current: 1.5A max.  
Contact: Copper Alloy  
Contact Resistance: 25 milliohms  
Dielectric Withstanding Voltage: 500V  
Insulation Resistance: 1,000 Megohms  
Impedance: 100 +/- 10 Ohms @ 50psec risetime  
Plating: Contact Area – 0.76µm (30µ”) min. select  
Gold and 3.81µm (150µ”) min. select Tin/Lead  
over 1.27µm (50µ”) min. Nickel overall  
Housing – 0.10µm (4µ”) max. Gold over 3.81µm  
(150µ”) min. Nickel over 3.81µm (150µ”) min.  
Copper  
CSA File No.: LR19980  
Mechanical  
Mating Force: 2.0N (.45lb) max. per circuit  
Unmating Force: 0.9N (.20lb) min. per circuit  
Durability: 25 cycles  
Operating Temperature: -20 to +85°C  
SMT Lead Coplanarity: 0.102mm (.004”)  
12

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