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74VCX32500GX PDF预览

74VCX32500GX

更新时间: 2024-11-24 23:24:35
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8页 83K
描述
18-Bit Bus Transceiver

74VCX32500GX 数据手册

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March 2001  
Revised September 2001  
74VCX32500  
Low Voltage 36-Bit Universal Bus Transceivers  
with 3.6V Tolerant Inputs and Outputs  
General Description  
The VCX32500 is an 36-bit universal bus transceiver which  
combines D-type latches and D-type flip-flops to allow data  
flow in transparent, latched, and clocked modes.  
Features  
1.65V–3.6V VCC supply operation  
3.6V tolerant inputs and outputs  
tPD (A to B, B to A)  
Data flow in each direction is controlled by output-enable  
(OEAB and OEBA), latch-enable (LEAB and LEBA), and  
clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the  
device operates in the transparent mode when LEAB is  
HIGH. When LEAB is LOW, the A data is latched if CLKAB  
is held at a HIGH or LOW logic level. If LEAB is LOW, the A  
bus data is stored in the latch/flip-flop on the HIGH-to-LOW  
transition of CLKAB. When OEAB is HIGH, the outputs are  
active. When OEAB is LOW, the outputs are in a high-  
impedance state.  
2.9 ns max for 3.0V to 3.6V VCC  
3.5 ns max for 2.3V to 2.7V VCC  
7.0 ns max for 1.65V to 1.95V VCC  
Power-down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
Static Drive (IOH/IOL  
)
±24 mA @ 3.0V VCC  
±18 mA @ 2.3V VCC  
±6 mA @ 1.65V VCC  
Data flow for B to A is similar to that of A to B but uses  
OEBA, LEBA, and CLKBA. The output enables are com-  
plementary (OEAB is active HIGH and OEBA is active  
LOW).  
Uses patented noise/EMI reduction circuitry  
Latchup performance exceeds 300 mA  
ESD performance:  
The VCX32500 is designed for low voltage (1.65V to 3.6V)  
VCC applications with I/O capability up to 3.6V.  
Human body model > 2000V  
The 74VCX32500 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing low CMOS power dissipation.  
Machine model >200V  
Packaged in plastic Fine-Pitch Ball Grid Array (FBGA)  
Note 1: To ensure the high-impedance state during power up or power  
down, OEBA should be tied to VCC through a pull-up resistor and OEAB  
should be tied to GND through a pull-down resistors; the minimum value of  
the resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74VCX32500GX  
(Note 2)  
BGA114A  
114-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[Tape and Reel]  
Note 2: BGA package available in Tape and Reel only.  
© 2001 Fairchild Semiconductor Corporation  
DS500403  
www.fairchildsemi.com  

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