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SCLS408H − APRIL 1998 − REVISED APRIL 2005
D
D
D
D
D
2-V to 5.5-V V
Operation
D
D
D
I
Supports Partial-Power-Down Mode
CC
off
Operation
Max t of 9.5 ns at 5 V
pd
Latch-Up Performance Exceeds 250 mA Per
JESD 17
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
A
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
Typical V
>2.3 V at V
(Output V
Undershoot)
OHV
CC
OH
= 3.3 V, T = 25°C
A
Support Mixed-Mode Voltage Operation on
All Ports
− 1000-V Charged-Device Model (C101)
SN54LV374A . . . FK PACKAGE
SN54LV374A . . . J OR W PACKAGE
SN74LV374A . . . DB, DGV, DW, NS,
OR PW PACKAGE
SN74LV374A . . . RGY PACKAGE
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
3
2
1
20 19
18
1
20
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
1
2
3
4
5
6
7
8
9
20
8D
7D
7Q
2D
2Q
3Q
3D
4D
4
5
6
7
8
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
1Q
1D
2D
2Q
3Q
3D
4D
4Q
8Q
8D
7D
7Q
6Q
6D
5D
5Q
19 8Q
18 8D
17 7D
16 7Q
15 6Q
14 6D
13 5D
12 5Q
11 CLK
17
16
15 6Q
14
9 10 11 12 13
6D
10
11
GND 10
description/ordering information
The ’LV374A devices are octal edge-triggered D-type flip-flops designed for 2-V to 5.5-V V
operation.
CC
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
QFN − RGY
SOIC − DW
Reel of 1000
Tube of 25
SN74LV374ARGYR
SN74LV374ADW
SN74LV374ADWR
SN74LV374ANSR
SN74LV374ADBR
SN74LV374APW
SN74LV374APWR
SN74LV374APWT
SN74LV374ADGVR
SN74LV374AGQNR
SNJ54LV374AJ
LV374A
LV374A
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
SOP − NS
74LV374A
LV374A
LV374A
LV374A
LV374A
LV374A
LV374A
SSOP − DB
−40°C to 85°C
Reel of 2000
Reel of 250
Reel of 2000
Reel of 1000
Tube of 20
TSSOP − PW
TVSOP − DGV
VFBGA − GQN
CDIP − J
SNJ54LV374AJ
SNJ54LV374AW
SNJ54LV374AFK
−55°C to 125°C
CFP − W
Tube of 85
SNJ54LV374AW
SNJ54LV374AFK
LCCC − FK
Tube of 55
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
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