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74LCX245BQX_08 PDF预览

74LCX245BQX_08

更新时间: 2024-02-09 22:06:13
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飞兆/仙童 - FAIRCHILD /
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14页 876K
描述
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs

74LCX245BQX_08 数据手册

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February 2008  
74LCX245  
Low Voltage Bidirectional Transceiver with 5V Tolerant  
Inputs and Outputs  
Features  
General Description  
5V tolerant inputs and outputs  
The LCX245 contains eight non-inverting bidirectional  
buffers with 3-STATE outputs and is intended for bus  
oriented applications. The device is designed for low  
2.3V to 3.6V V specifications provided  
CC  
7.0ns t max. (V = 3.3V), 10µA I max.  
PD  
CC  
CC  
voltage (2.5V and 3.3V) V applications with capability  
CC  
Power down high impedance inputs and outputs  
of interfacing to a 5V signal environment. The T/R input  
determines the direction of data flow through the device.  
The OE input disables both the A and B ports by placing  
them in a high impedance state.  
(1)  
Supports live insertion/withdrawal  
24mA output drive (V = 3.0V)  
CC  
Implements proprietary noise/EMI reduction circuitry  
Latch-up performance exceeds 500mA  
ESD performance:  
The LCX245 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
– Human body model > 2000V  
– Machine model > 200V  
Leadless DQFN package  
Note:  
1. To ensure the high-impedance state during power up  
or down, OE should be tied to V through a pull-up  
CC  
resistor: the minimum value or the resistor is  
determined by the current-sourcing capability of the  
driver.  
Ordering Information  
Package  
Order Number  
Number  
Package Description  
74LCX245WM  
M20B  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
74LCX245SJ  
M20D  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
(2)  
74LCX245BQX  
MLP20B  
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),  
JEDEC MO-241, 2.5 x 4.5mm  
74LCX245MSA  
74LCX245MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,  
4.4mm Wide  
Note:  
2. DQFN package available in Tape and Reel only.  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
©1994 Fairchild Semiconductor Corporation  
74LCX245 Rev. 1.11.0  
www.fairchildsemi.com  

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