是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | QFN | 包装说明: | HVQCCN, LCC24/28,.14X.2,20 |
针数: | 24 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 8.03 |
模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER | JESD-30 代码: | R-PQCC-N24 |
JESD-609代码: | e4 | 长度: | 5.5 mm |
湿度敏感等级: | 1 | 信道数量: | 16 |
功能数量: | 1 | 端子数量: | 24 |
标称断态隔离度: | 50 dB | 通态电阻匹配规范: | 6 Ω |
最大通态电阻 (Ron): | 130 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC24/28,.14X.2,20 |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 2/10 V |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.32 mA |
最大供电电压 (Vsup): | 10 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 9 V | 表面贴装: | YES |
最长断开时间: | 57 ns | 最长接通时间: | 63 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | NICKEL PALLADIUM GOLD |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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