74AUP1G07GW-G

更新时间： 2024-02-23 14:28:26

品牌	Logo	应用领域
恩智浦 - NXP		线路驱动器或接收器驱动程序和接口接口集成电路
页数	文件大小	规格书
16页	84K
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74AUP1G07GW-G 数据手册

74AUP1G07

NXP Semiconductors

Low-power buffer with open-drain output

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

SOT886

4×

(2)

6×

(2)

terminal 1

index area

2 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

max max

0.25

0.17

1.5

1.4

1.05

0.95

0.35 0.40

0.27 0.32

0.5 0.04

0.6

0.5

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

REFERENCES

JEDEC JEITA

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

04-07-15

04-07-22

SOT886

MO-252

Fig 10. Package outline SOT886 (XSON6)

74AUP1G07_2

Product data sheet

Rev. 02 — 14 June 2007

12 of 16

1...9 10 111213 14 15 16

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