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7133SA70PF PDF预览

7133SA70PF

更新时间: 2023-02-26 14:12:59
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器
页数 文件大小 规格书
16页 137K
描述
Dual-Port SRAM, 2KX16, 70ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

7133SA70PF 数据手册

 浏览型号7133SA70PF的Datasheet PDF文件第6页浏览型号7133SA70PF的Datasheet PDF文件第7页浏览型号7133SA70PF的Datasheet PDF文件第8页浏览型号7133SA70PF的Datasheet PDF文件第10页浏览型号7133SA70PF的Datasheet PDF文件第11页浏览型号7133SA70PF的Datasheet PDF文件第12页 
IDT7133SA/LA,IDT7143SA/LA  
High-Speed 2K x 16 Dual-Port RAM  
Military, Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
OperatingTemperatureandSupplyVoltage(5)  
7133X20  
7143X20  
7133X25  
7143X25  
7133X35  
7143X35  
Com'l Only  
Com'l, Ind  
& Military  
Com'l, Ind  
& Military  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
EW  
AW  
AS  
WP  
WR  
DW  
HZ  
DH  
WZ  
OW  
Write Cycle Time(3)  
20  
15  
15  
0
25  
20  
20  
0
35  
25  
25  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Enable to End-of-Write  
Address Valid to End-of-Write  
Address Set-up Time  
Write Pulse Width  
t
t
t
15  
0
20  
0
25  
0
t
Write Recovery Time  
Data Valid to End-of-Write  
Output High-Z Time(1,2)  
Data Hold Time(4)  
t
15  
15  
20  
____  
____  
____  
t
12  
15  
20  
____  
____  
____  
t
0
0
0
(1,2)  
____  
____  
____  
t
Write Enable to Output in High-Z  
Output Active from End-of-Write(1, 2,4)  
12  
15  
20  
____  
____  
____  
t
0
0
0
ns  
2746 tbl 11a  
7133X45  
7133X55  
7133X70/90  
7143X45  
Com'l &  
Military  
7143X55  
Com'l, Ind  
& Military  
7143X70/90  
Com'l &  
Military  
Symbol  
WRITE CYCLE  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
EW  
AW  
AS  
WP  
WR  
DW  
HZ  
DH  
WZ  
OW  
Write Cycle Time(3)  
45  
30  
30  
0
55  
40  
40  
0
70/90  
50/50  
50/50  
0/0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Enable to End-of-Write  
Address Valid to End-of-Write  
Address Set-up Time  
Write Pulse Width  
t
t
t
30  
0
40  
0
50/50  
0/0  
t
Write Recovery Time  
Data Valid to End-of-Write  
Output High-Z Time(1,2)  
Data Hold Time(4)  
t
20  
25  
30/30  
____  
____  
____  
t
20  
20  
25/25  
____  
____  
____  
t
5
5
5/5  
(1,2)  
____  
____  
____  
t
Write Enable to Output in High-Z  
20  
20  
25/25  
____  
____  
____  
t
Output Active from End-of-Write(1, 2,4)  
5
5
5/5  
ns  
2746 tbl 11b  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage from the Output Test Load (Figure 2).  
2. This parameter is guaranteed by device characterization but not production tested.  
3. For MASTER/SLAVE combination, tWC = tBAA + tWR + tWP, since R/W = VIL must occur after tBAA.  
4. The specification for tDH must be met by the device supplying write data to the RAM under all operation conditions. Although tDH and tOW values will very over voltage and  
temperature, the actual tDH will always be smaller than the actual tOW.  
5. 'X' in part number indicates power rating (SA or LA).  
9
6.42  

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