5秒后页面跳转
捷配首页

Datasheet > 5962-9458501H9A
5962-9458501H9A PDF预览

5962-9458501H9A

更新时间： 2024-02-09 01:54:38
品牌 Logo 应用领域
其他 - ETC 内存集成电路可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
42页 374K
描述
EEPROM

阅读下载

中文翻译

获取价格

5962-9458501H9A 技术参数

生命周期：Active零件包装代码：QFP
包装说明：CERAMIC, QFP-68针数：68
Reach Compliance Code：unknownECCN代码：3A001.A.2.C
HTS代码：8542.32.00.51风险等级：5.24
Is Samacsys：N最长访问时间：300 ns
其他特性：USER CONFIGURABLE AS 512K X 8备用内存宽度：16
JESD-30 代码：S-CQFP-G68长度：23.875 mm
内存密度：4194304 bit内存集成电路类型：EEPROM MODULE
内存宽度：32功能数量：1
端子数量：68字数：131072 words
字数代码：128000工作模式：ASYNCHRONOUS
最高工作温度：125 °C最低工作温度：-55 °C
组织：128KX32封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：QFP封装形状：SQUARE
封装形式：FLATPACK并行/串行：PARALLEL
编程电压：5 V认证状态：Qualified
筛选级别：MIL-STD-883座面最大高度：3.56 mm
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：4.5 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子形式：GULL WING端子节距：1.27 mm
端子位置：QUAD宽度：23.875 mm
最长写入周期时间 (tWC)：10 msBase Number Matches：1

5962-9458501H9A 数据手册

 浏览型号5962-9458501H9A的Datasheet PDF文件第1页浏览型号5962-9458501H9A的Datasheet PDF文件第2页浏览型号5962-9458501H9A的Datasheet PDF文件第3页浏览型号5962-9458501H9A的Datasheet PDF文件第5页浏览型号5962-9458501H9A的Datasheet PDF文件第6页浏览型号5962-9458501H9A的Datasheet PDF文件第7页 
2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a  
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in  
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the  
solicitation.  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883 - Test Method Standard Microcircuits.  
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.  
HANDBOOKS  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text  
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a  
specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in  
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as  
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.  
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).  
Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not  
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device  
class.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified  
in MIL-PRF-38534 and herein.  
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.  
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.  
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, and 7.  
3.2.5 Block diagram. The block diagram shall be as specified on figure 8.  
3.2.5 Typical output test circuit. The typical output test circuit shall be as specified on figure 9.  
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are  
as specified in table I and shall apply over the full specified operating temperature range.  
SIZE  
STANDARD  
5962-94585  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
H
4
DSCC FORM 2234  
APR 97  
1234567...42

中文翻译

下载PDF

与5962-9458501H9A相关器件

型号 品牌 获取价格 描述 数据表
5962-9458501H9C ETC

获取价格

 		EEPROM
5962-9458501H9X WEDC

获取价格

 		EEPROM Module, 128KX32, 300ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68
5962-9458501HMA ETC

获取价格

 		x32 EEPROM Module
5962-9458501HMC ETC

获取价格

 		x32 EEPROM Module
5962-9458501HMX MICROSEMI

获取价格

 		EEPROM Module,
5962-9458501HNC ETC

获取价格

 		x32 EEPROM Module
5962-9458501HNX MICROSEMI

获取价格

 		EEPROM Module, 128KX32, 300ns, Parallel, CMOS, CQMA68, CERAMIC, QFP-68
5962-9458501HTA ETC

获取价格

 		x32 EEPROM Module
5962-9458501HTC ETC

获取价格

 		x32 EEPROM Module
5962-9458501HUA ETC

获取价格

 		x32 EEPROM Module

与5962-9458501H9A相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证