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48206-0001 PDF预览

48206-0001

更新时间: 2024-11-11 06:28:43
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
3页 168K
描述
Fully Buffered DIMM Socket 240 CircuitWith Color Options

48206-0001 数据手册

 浏览型号48206-0001的Datasheet PDF文件第2页浏览型号48206-0001的Datasheet PDF文件第3页 
1.00mm (.039") Pitch  
Fully Buffered DIMM Socket  
240 Circuit  
FEATURES AND SPECIFICATIONS  
Molex offers the Fully Buffered DIMM with color options for server applications.  
With Color Options  
The development of Fully Buffered DIMM (FB DIMM) came from the need for larger  
and faster memory capacity where memory coordination and accuracy at high speeds  
are critical which DDR2 is not capable of supporting.  
48206  
The FB DIMM is a variant of the DDR2. It combines the high-speed internal  
architecture of DDR2 with a bi-directional point-to-point serial memory interface  
which links each FB DIMM module together in a chain. The difference is here in which  
the DDR2 uses a single memory bus.  
Vertical, Through Hole  
Molex is an active member of the JEDEC work group that defines industry standards  
for memory. This allows Molex to ensure that all our memory sockets are 100%  
industry compatible.  
Features  
Benefits  
• High-temperature thermoplastic housing  
• Accepts JEDEC defined module MO-256  
• Complies with JEDEC SO-003 socket specifications  
• Dual ejector latches  
• Lead-free process compatible  
• Ensures 100% industry compatibility  
• Ensures easy module insertion and removal with minimal micro  
motion  
• Built in end key design  
• Latch tower support  
• Ensures correct insertion of FB memory module  
• Aids in keeping the module vertical  
• Beveled metal pins (forklocks)  
• Provides proper socket to PCB alignment and retention, during and  
after soldering  
SPECIIFICATIONS  
Reference Information  
Mechanical  
Packaging: Tray  
UL File No.: TBD  
Contact retention to housing: 3N min (Contact)  
13N min (Forklock)  
CSA File No.:TBD  
Insertion Force to PCB: 0.56N (0.13lb)  
Mating Force: 0.81N (0.18lb)  
Unmating Force: 0.02N (0.01lb)  
Latch Actuation Force: 45N max per latch  
Durability: 10 Cycles  
Mates With: JEDEC MO-256 memory modules  
Complies with: JEDEC SO-003 Socket Outline  
Designed In: Millimeters  
Electrical  
Voltage: 30V  
Physical  
Current: 0.5A  
Housing: See order table  
Flammability rating: UL 94V-0  
Contact: Copper (Cu) Alloy  
PCB thickness: 1.60mm (.062”)  
Plating:  
Contact Resistance: 20 milliohms max  
Dielectric Withstanding Voltage: 500V AC  
Insulation Resistance: 1000 Megohms min  
Contact Area — See order table  
Solder Tail Area —Tin (Sn), Lead-free  
Underplating — Nickel  
Operating Temperature: +260°C max.  

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