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48206-0004 PDF预览

48206-0004

更新时间： 2024-11-11 06:28:43
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器PC
页数 文件大小 规格书
3页 168K
描述
Fully Buffered DIMM Socket 240 CircuitWith Color Options

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中文翻译

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48206-0004 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：ROHS COMPLIANTReach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8536.69.40.40
风险等级：5.77Is Samacsys：N
其他特性：LATCHED板上安装选件：SPLIT BOARD LOCK
主体宽度：0.289 inch主体深度：0.618 inch
主体长度：5.551 inch主体/外壳类型：SOCKET
连接器类型：CARD EDGE CONNECTOR联系完成配合：NOT SPECIFIED
触点性别：FEMALE触点材料：NOT SPECIFIED
触点电阻：20 m Ω触点样式：CENTRONIC
DIN 符合性：NO介电耐压：500VAC V
耐用性：25 Cycles滤波功能：NO
IEC 符合性：NO绝缘电阻：1000000000 Ω
绝缘体颜色：BLACK绝缘体材料：NYLON
MIL 符合性：NO插接触点节距：0.039 inch
混合触点：NO安装选项1：LATCH & EJECT
安装选项2：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：4装载的行数：2
最高工作温度：60 °C选件：GENERAL PURPOSE
PCB接触模式：STAGGEREDPCB触点行间距：0.075 mm
电镀厚度：30u inch极化密钥：POLARIZED KEY
额定电流（信号）：0.5 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子长度：0.125 inch端子节距：1 mm
端接类型：SOLDER触点总数：240
UL 易燃性代码：94V-0Base Number Matches：1

48206-0004 数据手册

 浏览型号48206-0004的Datasheet PDF文件第2页浏览型号48206-0004的Datasheet PDF文件第3页 
1.00mm (.039") Pitch  
Fully Buffered DIMM Socket  
240 Circuit  
FEATURES AND SPECIFICATIONS  
Molex offers the Fully Buffered DIMM with color options for server applications.  
With Color Options  
The development of Fully Buffered DIMM (FB DIMM) came from the need for larger  
and faster memory capacity where memory coordination and accuracy at high speeds  
are critical which DDR2 is not capable of supporting.  
48206  
The FB DIMM is a variant of the DDR2. It combines the high-speed internal  
architecture of DDR2 with a bi-directional point-to-point serial memory interface  
which links each FB DIMM module together in a chain. The difference is here in which  
the DDR2 uses a single memory bus.  
Vertical, Through Hole  
Molex is an active member of the JEDEC work group that defines industry standards  
for memory. This allows Molex to ensure that all our memory sockets are 100%  
industry compatible.  
Features  
Benefits  
• High-temperature thermoplastic housing  
• Accepts JEDEC defined module MO-256  
• Complies with JEDEC SO-003 socket specifications  
• Dual ejector latches  
• Lead-free process compatible  
• Ensures 100% industry compatibility  
• Ensures easy module insertion and removal with minimal micro  
motion  
• Built in end key design  
• Latch tower support  
• Ensures correct insertion of FB memory module  
• Aids in keeping the module vertical  
• Beveled metal pins (forklocks)  
• Provides proper socket to PCB alignment and retention, during and  
after soldering  
SPECIIFICATIONS  
Reference Information  
Mechanical  
Packaging: Tray  
UL File No.: TBD  
Contact retention to housing: 3N min (Contact)  
13N min (Forklock)  
CSA File No.:TBD  
Insertion Force to PCB: 0.56N (0.13lb)  
Mating Force: 0.81N (0.18lb)  
Unmating Force: 0.02N (0.01lb)  
Latch Actuation Force: 45N max per latch  
Durability: 10 Cycles  
Mates With: JEDEC MO-256 memory modules  
Complies with: JEDEC SO-003 Socket Outline  
Designed In: Millimeters  
Electrical  
Voltage: 30V  
Physical  
Current: 0.5A  
Housing: See order table  
Flammability rating: UL 94V-0  
Contact: Copper (Cu) Alloy  
PCB thickness: 1.60mm (.062”)  
Plating:  
Contact Resistance: 20 milliohms max  
Dielectric Withstanding Voltage: 500V AC  
Insulation Resistance: 1000 Megohms min  
Contact Area — See order table  
Solder Tail Area —Tin (Sn), Lead-free  
Underplating — Nickel  
Operating Temperature: +260°C max.  
123

中文翻译

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