■ Marking on contrasting background for
Features
permanent identification
■ Lead free versions available (see How to
■ Compliant leads to reduce solder joint
fatiguing
■ Standard electrical schematics: isolated,
bussed, dual terminator
■ Now available with improved tolerance
to 0ꢀ. ꢁ
Order “Termination” option)
■ RoHS compliant (lead free version)*
■ Standard E.I.A. package compatible with
automatic placement equipment
■ Tape and reel packaging standard
■ Custom circuits are available
4800P Series - Thick Film Surface Mounted Medium Body
Package Power Temp. Derating Curve
Product Dimensions
Product Characteristics
Resistance Range
5.59 ± .12
(.220 ± .005)
4820P
4818P
4816P
1.6
.....................10 ohms to 2.2 megohms
Maximum Operating Voltage............50 V
Temperature Coefficient of Resistance
50 ohms and above......... 100 ppmꢀ/C
below 50 ohms................ 250 ppmꢀ/C
TCR Tracking
1.4
4814P
1.2
1.0
.8
.432 ± .076
(.017 ± .003)
TYP.
7.62 ± .25
(.300 ± .010)
.6
(for equal values within a package)
..50 ppmꢀ/C max. for values > 50 ohms;
........100 ppmꢀ/C for values ≤ 50 ohms
Operating Temperature
.................................-55 /C to +125 /C
Insulation Resistance
.4
13.72 ± .12
(.540 ± .005)
.2
12.45 ± .12
(.490 ± .005)
0
25
70
AMBIENT TEMPERATURE ( C )
125
11.18 ± .12
(.440 ± .005)
°
9.91 ± .12
(.390 ± .005)
..........................10,000 megohms min.
Dielectric Withstanding Voltage
.............................................200 VRMS
Lead Solderability
.....Meet requirements of MIL-STD-202
Method 208
Package Power Rating at 70 /C
4814P......................................1.12 watts
4816P......................................1.28 watts
4818P......................................1.44 watts
4820P......................................1.60 watts
1.27 ± .076
(.050 ± .003*)
TYP.
.13 + .12/ - .00
(.005 + .005/ - .000)
2.03 ± .12
(.080 ± .005)
Environmental Characteristics
.305 + .000/ - .101
(.012 + .000/ - .004)
Typical Part Marking
TESTS PER MIL-STD-202 ........∆R MAX.
Short Time Overload.................. 0.25 ꢁ
Load Life.................................... 1.00 ꢁ
Moisture Resistance .................. 0.50 ꢁ
Resistance to Soldering Heat .... 0.25 ꢁ
Thermal Shock........................... 0.25 ꢁ
R = .008" TYP.
PART NUMBER
RESISTANCE
CODE
4816P-1
-330
YYWW
CIRCUIT
DATE CODE
8° MAX.
.611 ± .101
(.024 ± .004)
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
Lead coplanarity .102mm (.004 inch) max. at mounting surface.
Physical Characteristics
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
Flammability .........Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material....................Thermoplastic
Recommended Land Pattern
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
2.0
(.079)
TYP.
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
How To Order
SOM-14
8.26
(.325)
1.27
(.050)
TYP.
TYP.
SOM-16
9.53
(.375)
48 16 P - 1 - 103 __ __
Model
(48 = SOM Pkg)
SOM-18
10.80
(.425)
SOM-20
12.07
(.475)
.63
(.025)
Number of Pins
10 11
Electrical Configuration
• 1 or 4 = Isolated*
• 2 = Bussed*
4.9
(.193)
8.9
• 3 = Dual Terminator*
(.350)
Resistance Code
NOTE: Land pattern dimensions are based on
design rules established by the Institute for Inter-
connecting and Packaging Electronic Circuits in
IPC-SM-782.
• First 2 digits are significant
• Third digit represents the
number of zeros to follow.
Resistance Tolerance
• Blank = 2 ꢁ (see ꢂResistance Tolerance” on
next page for resistance range)
• F = 1 ꢁ (100 ohms - 1 megohm)
• D = 0.5 ꢁ (100 ohms - 1 megohm)
For Standard Values Used in Capacitors,
Inductors, and Resistors, click here.
Terminations
• All electrical configurations EXCEPT T03:
LF = Tin-plated (lead free)
• ONLY electrical configuration T03:
L = Tin-plated (lead free)
• Blank = TinꢀLead-plated
*For tube packaging, use T01, T02, T03 or T04.
Consult factory for other available options.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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