3SMAJ5933B-T

更新时间： 2024-11-10 13:04:35

品牌	Logo	应用领域
美微科 - MCC		稳压二极管齐纳二极管测试光电二极管
页数	文件大小	规格书
4页	129K
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中文翻译

获取价格

数据手册

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3SMAJ5933B-T 数据手册

3SMAJ5913B

THRU

3SMAJ5943B

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

3.0 Watt

Surface Mount

Silicon

ꢀ

Surface Mount Application

3.3 thru 56 Volt Voltage Range

Low Inductance,Low Profile Mounting

ꢀ

Glass Passivated Junction

High specified maximum current (IZM) when adequately heat sinking

Zener Diodes

ꢀ

Mechanical Data

DO-214AC

ꢀ

Case Material: Molded Plastic. UL Flammability

ꢀ

(SMA) (LEAD FRAME)

ꢀ

Classification Rating 94V-0

ꢀ

Terminals solderable per MIL-STD-750, Method 2026

Polarity is indicated by cathode band.

ꢀ

Packaging: Standard 12mm Tape (see EIA 481)

Maximum temperature for soldering: 260⁰C for 10 seconds.

Maximum Ratings @ 25^oC Unless Otherwise Specified

Maximum

V_F

1.5V

(Note: 1)

(Note: 2)

Forward

Voltage

Steady State

P_d

3.0W

DIMENSIONS

Power

INCHES

MIN

.079

.050

.002

---

MIN

2.00

1.27

.05

Dissipation

DIM

MAX

2.44

1.63

.20

NOTE

Operation and

Storage

Temperature

T_J, T_STG-55^oC to

.096

.064

.008

.02

+150^oC

---

.51

.030

.065

.189

.157

.090

.060

.091

.220

.181

.115

.76

1.52

2.32

5.59

4.60

2.92

1.65

4.80

4.00

2.25

Thermal

25R/W

Resistance

Junction to Lead

R_thJL

SUGGESTED SOLDER

PAD LAYOUT

0.085 ”

MAX

NOTES:

Forward Current @ 200mA.

0.058 ”

Mounted on 5.0mm²(.013mm thick) Iand areas.

Lead temperature at T_L=75^oC

MIN

0.05

MIN

www.mccsemi.com

Revision: 3

2007/04/19

1 of 4

12 3 4

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