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3SMAJ5939B-TP-HF PDF预览

3SMAJ5939B-TP-HF

更新时间: 2024-02-03 12:51:49
品牌 Logo 应用领域
美微科 - MCC 稳压二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
4页 129K
描述
Zener Diode, 39V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, SMA, 2 PIN

3SMAJ5939B-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:DO-214AC包装说明:R-PDSO-C2
针数:2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.44配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JEDEC-95代码:DO-214ACJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:3 W
标称参考电压:39 V表面贴装:YES
技术:ZENER端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10最大电压容差:5%
工作测试电流:9.6 mABase Number Matches:1

3SMAJ5939B-TP-HF 数据手册

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3SMAJ5913B  
THRU  
3SMAJ5943B  
M C C  
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20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
3.0 Watt  
Surface Mount  
Silicon  
Surface Mount Application  
3.3 thru 56 Volt Voltage Range  
Low Inductance,Low Profile Mounting  
Glass Passivated Junction  
High specified maximum current (IZM) when adequately heat sinking  
Zener Diodes  
Mechanical Data  
DO-214AC  
Case Material: Molded Plastic. UL Flammability  
(SMA) (LEAD FRAME)  
Classification Rating 94V-0  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
H
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 2600C for 10 seconds.  
J
Maximum Ratings @ 25oC Unless Otherwise Specified  
A
C
E
Maximum  
VF  
D
B
F
1.5V  
(Note: 1)  
(Note: 2)  
Forward  
Voltage  
G
Steady State  
Pd  
3.0W  
DIMENSIONS  
Power  
INCHES  
MIN  
.079  
.050  
.002  
---  
MM  
MIN  
2.00  
1.27  
.05  
Dissipation  
DIM  
A
MAX  
MAX  
2.44  
1.63  
.20  
NOTE  
Operation and  
Storage  
Temperature  
TJ, TSTG -55oC to  
.096  
.064  
.008  
.02  
B
+150oC  
C
D
E
---  
.51  
.030  
.065  
.189  
.157  
.090  
.060  
.091  
.220  
.181  
.115  
.76  
1.52  
2.32  
5.59  
4.60  
2.92  
F
1.65  
4.80  
4.00  
2.25  
G
H
J
Thermal  
25R/W  
Resistance  
Junction to Lead  
RthJL  
SUGGESTED SOLDER  
PAD LAYOUT  
0.085 ”  
MAX  
NOTES:  
1.  
2.  
Forward Current @ 200mA.  
0.058 ”  
Mounted on 5.0mm2 (.013mm thick) Iand areas.  
Lead temperature at TL=75oC  
MIN  
0.05  
MIN  
www.mccsemi.com  
Revision: 3  
2007/04/19  
1 of 4  

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