3N170 / 3N171
CORPORATION
ELECTRICAL CHARACTERISTICS (TA = 25oC unless otherwise specified) Substrate connected to source.
SYMBOL
PARAMETER
MIN
MAX
UNITS
TEST CONDITIONS
ID = 10µA, VGS = 0
GS = ±35V, VDS = 0
VGS = 35V, VDS = 0, TA = 125oC
DS = 10V, VGS = 0
BVDSS
Drain-Source Breakdown Voltage
25
V
V
±10
100
10
IGSS
Gate Leakage Current
pA
nA
V
IDSS
Zero-Gate-Voltage Drain Current
Gate-Source Threshold Voltage
TA = 125oC
1.0
2.0
3.0
µA
3N170
3N171
1.0
1.5
10
VGS(th)
V
VDS = 10V, ID = 10µA
ID(on)
"ON" Drain Current
mA
V
VGS = 10V, VDS = 10V
VDS(on)
rds(on)
Drain-Source "ON" Voltage
Drain-Source ON Resistance
Forward Transfer Admittance
Reverse Transfer Capacitance (Note 1)
Input Capacitance (Note 1)
Drain-Substrate Capacitance (Note 1)
Turn-On Delay Time (Note 1)
Rise Time (Note 1)
2.0
ID = 10mA, VGS = 10V
VGS = 10V, ID = 0, f = 1kHz
VDS = 10V, ID = 2.0mA, f = 1kHz
VDS = 0, VGS = 0, f = 1MHz
VDS = 10V, VGS = 0, f = 1MHz
VD(SUB) = 10V, f = 1MHz
200
Ω
| Yfs
Crss
Ciss
|
1000
µS
1.3
5.0
5.0
3.0
10
pF
ns
Cd(sub)
td(on)
tr
VDD = 10V, ID(on) = 10mA,
VGS(on) = 10V, VGS(off) = 0,
R
G = 50Ω
td(off)
tf
Turn-Off Delay Time (Note 1)
Fall Time (Note 1)
3.0
15
NOTE 1: For design reference only, not 100% tested.