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3KP11C PDF预览

3KP11C

更新时间: 2024-10-29 14:38:23
品牌 Logo 应用领域
WON-TOP /
页数 文件大小 规格书
6页 97K
描述
Axial

3KP11C 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:O-PALF-W2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.44Is Samacsys:N
最大击穿电压:15.4 V最小击穿电压:12.2 V
击穿电压标称值:13.8 V外壳连接:ISOLATED
最大钳位电压:20.1 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:O-PALF-W2JESD-609代码:e0
最大非重复峰值反向功率耗散:3000 W元件数量:1
端子数量:2最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):NOT SPECIFIED极性:BIDIRECTIONAL
最大功率耗散:8 W最大重复峰值反向电压:11 V
子类别:Transient Suppressors表面贴装:NO
技术:AVALANCHE端子面层:Tin/Lead (Sn/Pb)
端子形式:WIRE端子位置:AXIAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

3KP11C 数据手册

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®
3KP SERIES  
WON-TOP ELECTRONICS  
100  
80  
60  
40  
20  
0
300  
240  
180  
120  
60  
Single Half-Sine-Wave  
JEDEC Method  
0
0
15 30 45 60 75 90 105 120 135 150  
1
10  
100  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 1 Pulse Derating Curve  
NUMBER OF CYCLES AT 60Hz  
Fig. 2 Forward Surge Current Derating Curve  
10  
8
100  
10  
1
6
4
Mounted on 20 x 20 x 1.0mm  
copper pads to each terminal.  
Lead length = 9.5mm.  
TA = 25°C  
Non Repetitive  
Pulse Waveform  
Shown in Fig. 5  
2
0
0.1  
0
15 30 45 60 75 90 105 120 135 150  
0.1  
1
10  
100  
1000  
10000  
TL, LEAD TEMPERATURE (°C)  
Fig. 3 Steady State Power Derating Curve  
td, PULSE WIDTH (µs)  
Fig. 4 Pulse Rating Curve  
125  
100  
75  
50  
25  
0
100000  
TA = 25°C  
Pulse Width (td) is defined as  
the point where the peak  
current decays to 50% of IPPM  
tr = 10µs  
Peak Value IPPM  
Bi-Directional  
@ Zero Bias  
10000  
1000  
100  
Uni-Directional  
@ Zero Bias  
Uni-Directional  
@ VRWM  
Half Value IPP/2  
Bi-Directional  
@ VRWM  
10/1000µs Waveform  
as defined by R.E.A.  
TJ = 25°C  
f = 1MHz  
Vsig = 50mVp-p  
td  
10  
0
1
2
3
4
5
1
10  
100  
1000  
t, TIME (ms)  
Fig. 5 Pulse Waveform  
VBR, BREAKDOWN VOLTAGE (V)  
Fig. 6 Typical Junction Capacitance  
www.wontop.com  
2
© Won-Top Electronics Co., Ltd.  
Revision: September, 2012  

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