Datasheet > 37717-1001

37717-1001

更新时间： 2024-10-30 07:45:51

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
2页	101K
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CoolFin? Heat Sink with Integrated Heat Pipes

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37717-1001 数据手册

CoolFin™ Heat Sink with

Integrated Heat Pipes

Intel approved CoolFin™ heat sink from Molex achieves high performance and low

noise with innovative design.

Introducing the newest style of Molex heat sinks, CoolFin. CoolFin heat sinks are made from stamped

ﬁns soldered to base plates. CoolFin technology allows for variable ﬁn pitch, geometry, material type

and thickness. They are designed to maximize thermal efﬁciency in the smallest and lightest weight

package possible.

37717

For use with Intel* Pentium*4

“Prescott” Processor Socket 478

The 37717 series CoolFin heat sink has been designed to offer superior cooling for the Intel Pentium

“Prescott” microprocessor. It is available in different speeds or can be ﬁtted with a thermistor

controlled fan for motherboards without variable speed fan technology. These fan options help the

customer match cooling requirements with acoustic goals.

The 37717 series ﬁn package has been maximized to meet thermal performance and weight

requirements. In the center ﬁn group, copper is used directly above the heat source to maximize

thermal efﬁciency. The outer ﬁns are made up of lighter aluminum material to save weight. The two

heat pipes further increase efﬁciency and create 16-17% margin at the highest fan speed; this allows

customers to explore lower speed fans for better acoustics. The innovative “half-moon” base design

leaves tradition behind and saves weight, while achieving high performance to meet the needs of

Intel’s hottest new processor.

The standard heat sink comes with a 70,000 hour MTFB dual ball bearing fan, and ShinEtsu G-751

thermal interface material. Custom fans and interface are available on request.

*Intel and Pentium are registered trademarks of Intel Corporation

Features and Beneﬁts

■ Intel approved allows customers with limited

testing capability to specify part with

conﬁdence

■ At 31 dB-A the medium speed version meets

thermal spec which offers excellent acoustics

for sensitive environments

■ Meets Intel .330° C/W thermal resistance

target which ensures reliable system at any

usage level

■ Dual ball fan provides much higher

reliability than ball/sleeve, up to 70,000 hrs

MTBF

■ At .275°C/W the 6000 RPM version offers

17% margin over Intel speciﬁcation which

gives customer ability to scale up to higher

speed processor without upgrading heat sink

■ Low weight: 435 grams (Intel max spec.=

450g) applies less stress on socket or board

■ Easy to use, robust clip design is easy to

assemble, ensures proper application force

SPECIFICATIONS

Reference

Thermal Efﬁciency (°C/W)

Thermal Interface Material options:

ShinEtsu – G-751

Packaging: Tray/Box

Fan UL File No.: Various

Fan CSA File No : Various

Mates With: Socket 478

Designed In: mm

37717-0001: .275 °C/W

Note: Custom interface or fan options available on

Mechanical

Retention Clip mating Force: 55-65 lbs total

request.

Physical

Weight: 435g

Fan size: 70x15mm

Fan bearing type: Dual ball

Heat sink: Copper base, Copper/Aluminum fins, Copper

heat pipes

Electrical: 37717-0001

Fan min. starting Voltage: 4 VDC

Operational voltage range: 4–12.5 VDC

Current: .35A

Connector: Molex 3 Pin 2695-03-22-01-3037

Operating temp: 0 to + 85°C

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与37717-1001相关器件

型号	品牌	获取价格	描述	数据表
3771G-18LF	IDT	获取价格	PLL Based Clock Driver, 3771 Series, 4 True Output(s), 0 Inverted Output(s), PDSO16, 0.40
3771G-18LFT	IDT	获取价格	PLL Based Clock Driver, 3771 Series, 4 True Output(s), 0 Inverted Output(s), PDSO16, 0.40
3773F	ETC	获取价格	PRODUCT SPECIFICATION
377537	TE	获取价格	ANVIL, SPLICE
3777-0	POMONA	获取价格	Interconnection Device
3777A	POMONA	获取价格	Spade Lug to Banana Jack
3777A-0	POMONA	获取价格	Interconnection Device
3777A-02	POMONA	获取价格	Interconnection Device
3778	POMONA	获取价格	BNC (Female) Isolated Ground Bulkhead Receptacle
377808	TE	获取价格	INDENTOR ANVIL

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