Datasheet > 315-99-113-41-001000

315-99-113-41-001000

更新时间： 2024-11-02 00:35:19

品牌	Logo	应用领域
仕元机械 - MILL-MAX		/
页数	文件大小	规格书
3页	120K
描述
Interconnect Socket Low Profile Solder Tail Socket

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315-99-113-41-001000 数据手册

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Product Number: 315-93-153-41-001000

Description:

Interconnect Socket

Low Profile Solder Tail Socket

Accepts .015"- .025" (0,38 - 0,635

mm) dia leads

Single Row

Through Hole

Plating Code:

Shell Plating:

200 μ" Tin/Lead(93/7) over 100 μ"

Nickel

Inner Contact Plating:

30 μ" Gold over 50 μ" Nickel

Mill-Max

Part

RoHS

Compliant

Pins

Number

315-93-153-41-001000

CONTACT:

Contact Used: #30, Standard 4 Finger Contact

Current Rating = 3 Amps

BERYLLIUM COPPER ALLOY 172 (UNS C17200) per ASTM B 194

Properties of BERYLLIUM COPPER:

Chemical composition: Cu 98.1%, Be 1.9%

Temper as stamped: TD01

Properties after heat treatment (TH01):

Hardness: 36-43 Rockwell C

Mechanical Life: 1000 Cycles Min.

Density: .298 lbs/in3

Electrical Conductivity: 22% IACS*

Resistance: 10 miliohms Max

Operating Temperature: -55°C/+125°C

Melting point: 980°C/865°C (liquidus/solidus)

Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 °C; 70% of stress remains after 1,000 hours

@ 200 °C

*International Annealed Copper Standard, i.e. as a % of pure copper.

†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For

applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.

LOOSE PIN:

Pin Used: 0501 (Brass Alloy)

Mill-Max Mfg. Corp. Datasheet — Last Modified 4/29/2018

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315-99-115-41-001000	MILL-MAX	获取价格	Interconnect Socket Low Profile Solder Tail Socket
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