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315-99-115-41-003000 PDF预览

315-99-115-41-003000

更新时间: 2024-11-07 00:38:35
品牌 Logo 应用领域
仕元机械 - MILL-MAX /
页数 文件大小 规格书
3页 120K
描述
Interconnect Socket Low Profile Solder Tail Socket

315-99-115-41-003000 数据手册

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Product Number: 315-99-150-41-003000  
Description:  
Interconnect Socket  
Low Profile Solder Tail Socket  
Accepts .015"- .022" (0,38 - 0,559  
mm) dia leads  
Single Row  
Through Hole  
Plating Code:  
99  
Shell Plating:  
200 μ" Tin/Lead(93/7) over 100 μ"  
Nickel  
Inner Contact Plating:  
100 μ" Tin/Lead(93/7) over 50 μ"  
Nickel  
#
Of  
Mill-Max  
Part  
RoHS  
Compliant  
Pins  
Number  
50  
315-99-150-41-003000  
CONTACT:  
Contact Used: #12, Standard 4 Finger Contact  
Current Rating = 3 Amps  
BERYLLIUM COPPER ALLOY 172 (UNS C17200) per ASTM B 194  
Properties of BERYLLIUM COPPER:  
Chemical composition: Cu 98.1%, Be 1.9%  
Temper as stamped: TD01  
Properties after heat treatment (TH01):  
Hardness: 36-43 Rockwell C  
Mechanical Life: 1000 Cycles Min.  
Density: .298 lbs/in3  
Electrical Conductivity: 22% IACS*  
Resistance: 10 miliohms Max  
Operating Temperature: -55°C/+125°C  
Melting point: 980°C/865°C (liquidus/solidus)  
Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 °C; 70% of stress remains after 1,000 hours  
@ 200 °C  
*International Annealed Copper Standard, i.e. as a % of pure copper.  
†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For  
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.  
LOOSE PIN:  
Pin Used: 1534 (Brass Alloy)  
Mill-Max Mfg. Corp. Datasheet — Last Modified 5/8/2018  
Page 1 of 3  

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