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3090-820KK PDF预览

3090-820KK

更新时间: 2024-10-29 13:04:31
品牌 Logo 应用领域
API /
页数 文件大小 规格书
1页 1145K
描述
General Purpose Inductor, 0.082uH, 10%, 1 Element, Iron-Core, SMD, CHIP

3090-820KK 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:ActiveReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.69Is Samacsys:N
型芯材料:IRON直流电阻:0.19 Ω
标称电感 (L):0.082 µH电感器应用:RF INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e4
功能数量:1端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
最小质量因数(标称电感时):25最大额定电流:0.63 A
自谐振频率:650 MHz形状/尺寸说明:RECTANGULAR PACKAGE
屏蔽:NO表面贴装:YES
端子面层:Gold (Au) - with Nickel (Ni) barrier端子位置:DUAL ENDED
端子形状:WRAPAROUND测试频率:50 MHz
容差:10%Base Number Matches:1

3090-820KK 数据手册

  
3090R  
3090  
SERIES  
Micro i® Low Profile Chip Inductors  
SERIES 3090 IRON CORE  
0.010  
0.015  
0.022  
0.033  
0.039  
0.047  
0.056  
0.068  
0.082  
0.10  
0.12  
0.15  
0.18  
0.22  
0.27  
0.33  
0.39  
0.47  
0.56  
0.68  
0.82  
1.00  
1.20  
1.50  
1.80  
2.20  
2.70  
3.30  
3.90  
4.70  
5.60  
6.80  
8.20  
20%  
20%  
20%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
10%  
42  
42  
40  
40  
40  
38  
35  
30  
25  
32  
32  
32  
32  
34  
34  
34  
34  
34  
34  
30  
28  
24  
24  
24  
24  
25  
25  
25  
25  
24  
22  
22  
22  
20  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
50.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
25.0  
7.9  
1000  
1000  
1000  
900  
900  
900  
800  
700  
650  
510  
410  
370  
330  
300  
250  
220  
200  
180  
160  
140  
120  
100  
95  
0.095  
0.115  
0.140  
0.185  
0.100  
0.110  
0.135  
0.16  
0.19  
0.08  
0.10  
0.12  
0.14  
0.16  
0.20  
0.25  
0.30  
0.36  
0.45  
0.50  
0.60  
0.70  
1.10  
1.20  
1.25  
1.30  
1.50  
1.90  
2.30  
3.00  
3.50  
4.00  
4.50  
5.00  
890  
810  
765  
640  
870  
830  
750  
690  
630  
970  
870  
795  
765  
690  
615  
550  
500  
460  
410  
390  
355  
330  
265  
250  
245  
240  
225  
200  
180  
160  
145  
135  
130  
120  
-100M  
-150M  
-220M  
-330K  
-390K  
-470K  
-560K  
-680K  
-820K  
-101K  
-121K  
-151K  
-181K  
-221K  
-271K  
-331K  
-391K  
-471K  
-561K  
-681K  
-821K  
-102K  
-122K  
-152K  
-182K  
-222K  
-272K  
-332K  
-392K  
-472K  
-562K  
-682K  
-822K  
-103K  
Actual Size  
Physical Parameters  
Inches  
Millimeters  
1.27 Max.  
2.54 0.254  
2.54 0.254  
1.27 Min.  
A
B
C
D
E
F
0.050 Max.  
0.100 0.010  
0.100 0.010  
0.050 Min.  
0.015 Min. (Typ.)  
0.020 Max. (Typ.) 0.51 Max. (  
7.9  
7.9  
7.9  
7.9  
7.9  
7.9  
7.9  
7.9  
90  
85  
80  
70  
65  
60  
55  
53  
0.38 Min. (T  
yp.)  
Typ.)  
Current Rating at 90°C Ambient 35°C  
Rise  
Operating Temperature Range  
55°C  
to +125°C  
0.105 W  
proved  
Maximum Power Dissipation at 90°C  
7.9  
7.9  
7.9  
50  
45  
40  
Core Material Powdered iron core for im  
temperature stability.  
10.0  
Mechanical Configuration Units are ep  
oxy  
encapsulated. Contact area for reflow sold  
ering are gold  
plated per MIL-G-45204 Type 1 Grade A.  
connections are thermal compression bon  
Internal  
ded.  
Optional Tolerances: J = 5% H = 3% G = 2% F = 1%  
*Complete part # must include series # PLUS the dash #  
For surface finish information, refer to www.delevanfinishes.com  
Termination Finish Options  
Standard: Gold over Nickel.  
For Tin/Lead over Nickel: Add suffix “S” to  
allow an additional .010 inch for maximum  
RoHS, order 3090R - XXXKS.  
part number and  
height. For  
Notes 1) Designed specifically for reflow  
other high temperature processes with m  
exhibit solder fillet. 2) Self Resonant Freq  
soldering and  
etalized edges to  
uency (SRF)  
values 250 MHz and above are calculated  
reference only.  
and for  
Packaging Tape & reel (8mm): 7" reel, 2  
000 pieces max.;  
13" reel, 8000 pieces max.  
MIL-PRF-83446 (Reference) for testing m  
ethods only.  
Made in the U.S.A.  
.
270 Quaker Rd., East Aurora NY 14052 • Phone 716-652-3600 • Fax 716-652-4814 • E-mail: apisales@delevan com • www.delevan.com  
1/2009  

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