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2SK3905(F)

更新时间: 2024-01-27 04:55:13
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
6页 239K
描述
2SK3905(F)

2SK3905(F) 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.76配置:Single
最大漏极电流 (Abs) (ID):17 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
子类别:FET General Purpose Power表面贴装:NO
Base Number Matches:1

2SK3905(F) 数据手册

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2SK3905  
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (π-MOSVI)  
2SK3905  
Switching Regulator Applications  
Unit: mm  
Low drain-source ON resistance: R  
= 0.25 Ω (typ.)  
DS (ON)  
High forward transfer admittance: Y = 8.2 S (typ.)  
fs  
Low leakage current: I  
= 100 μA (max) (V  
= 500 V)  
DSS  
DS  
Enhancement model: V = 2.0~4.0 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
500  
500  
±30  
17  
V
V
V
DSS  
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
V
GS  
DGR  
V
GSS  
DC  
(Note 1)  
I
D
Drain current  
A
1. GATE  
Pulse (Note 1)  
I
68  
DP  
2. DRAIN (HEATSINK)  
3. SOURCE  
Drain power dissipation (Tc = 25°C)  
P
150  
W
D
AS  
AR  
Single pulse avalanche energy  
JEDEC  
E
816  
mJ  
(Note 2)  
JEITA  
SC-65  
216C1B  
Avalanche current  
I
17  
15  
A
TOSHIBA  
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
Weight: 4.6 g (typ.)  
T
150  
ch  
Storage temperature range  
T
55~150  
stg  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and  
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Thermal Characteristics  
2
Characteristic  
Symbol  
Max  
Unit  
Thermal resistance, channel to case  
Thermal resistance, channel to ambient  
R
0.833  
50  
°C/W  
°C/W  
th (ch-c)  
R
th (ch-a)  
1
Note 1: Ensure that the channel temperature does not exceed 150°C during  
use of the device.  
Note 2:  
V
DD  
= 90 V, T = 25°C, L = 4.8 mH, R = 25 Ω, I  
= 17 A  
AR  
ch  
G
Note 3: Repetitive rating: pulse width limited by max junction temperature  
This transistor is an electrostatic-sensitive device. Handle with care.  
3
1
2006-11-06  

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