2SK1151(L), 2SK1151(S), 2SK1152(L), 2SK1152(S)
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Symbol
Ratings
Unit
2SK1151
2SK1152
VDSS
450
V
500
Gate to source voltage
Drain current
VGSS
ID
ID(pulse)
IDR
±30
V
A
1.5
1
Drain peak current
*
6
1.5
A
Body to drain diode reverse drain current
Channel dissipation
A
Pch*2
20
W
°C
°C
Channel temperature
Tch
150
Storage temperature
Tstg
–55 to +150
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at TC = 25°C
Electrical Characteristics
(Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Drain to source breakdown 2SK1151
V(BR)DSS
450
500
±30
—
—
—
V
ID = 10 mA, VGS = 0
voltage
2SK1152
Gate to source breakdown voltage
Gate to source leak current
V(BR)GSS
IGSS
—
—
—
—
V
IG = ±100 µA, VDS = 0
VGS = ±25 V, VDS = 0
VDS = 360 V, VGS = 0
VDS = 400 V, VGS = 0
ID = 1 mA, VDS = 10 V
ID = 1 A, VGS = 10 V *3
±10
100
µA
µA
Zero gate voltage drain
current
2SK1151
IDSS
—
2SK1152
Gate to source cutoff voltage
VGS(off)
RDS(on)
2.0
—
—
0.6
—
—
—
—
—
—
—
—
—
—
3.5
4.0
1.1
160
45
5
3.0
5.5
6.0
—
—
—
—
—
—
—
—
—
—
V
Static drain to source on
state resistance
2SK1151
2SK1152
Ω
Forward transfer admittance
Input capacitance
|yfs|
Ciss
Coss
Crss
td(on)
tr
S
ID = 1 A, VDS = 20 V *3
pF
pF
pF
ns
ns
ns
ns
V
VDS = 10 V, VGS = 0,
f = 1 MHz
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
5
ID = 1 A, VGS = 10 V,
RL = 30 Ω
10
20
10
1.0
220
Turn-off delay time
Fall time
td(off)
tf
Body to drain diode forward voltage
VDF
trr
IF = 1.5 A, VGS = 0
Body to drain diode reverse recovery
time
ns
IF = 1.5 A, VGS = 0,
diF/dt = 100 A/µs
Note: 3. Pulse test
Rev.2.00 Sep 07, 2005 page 2 of 7