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2SA1774T1

更新时间： 2024-01-22 04:19:39
品牌 Logo 应用领域
安森美 - ONSEMI 晶体放大器晶体管
页数 文件大小 规格书
4页 53K
描述
PNP Silicon General Purpose Amplifier Transistor

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2SA1774T1 数据手册

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2SA1774  
PNP Silicon General  
Purpose Amplifier Transistor  
This PNP transistor is designed for general purpose amplifier  
applications. This device is housed in the SC−75/SOT−416/SC−90  
package which is designed for low power surface mount  
applications, where board space is at a premium.  
http://onsemi.com  
Features  
COLLECTOR  
3
• Reduces Board Space  
• High h , 210−460 (typical)  
FE  
• Low V  
, < 0.5 V  
CE(sat)  
• Available in 8 mm, 7−inch/3000 Unit Tape and Reel  
• Pb−Free Packages are Available*  
1
2
BASE  
EMITTER  
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Value  
−60  
Unit  
Vdc  
3
Collector − Emitter Voltage  
Collector − Base Voltage  
Emitter − Base Voltage  
V
(BR)CBO  
(BR)CEO  
(BR)EBO  
2
V
V
−50  
Vdc  
1
−6.0  
−100  
Vdc  
Collector Current − Continuous  
I
C
mAdc  
SC−75  
CASE 463−01  
STYLE 1  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
150  
Unit  
mW  
°C  
Power Dissipation (Note 1)  
Junction Temperature  
P
D
T
J
150  
MARKING DIAGRAM  
Storage Temperature Range  
T
stg  
−55 ~ +150  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
RecommendedOperating Conditions may affect device reliability.  
1. Device mounted on a FR−4 glass epoxy printed circuit board using the  
minimumrecommended footprint.  
F9 M G  
G
1
F9 = Device Code  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
May, 2006 − Rev. 6  
2SA1774/D  
 
1234

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