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2N6027 PDF预览

2N6027

更新时间: 2024-01-06 16:53:13
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管可编程单结晶体管PC
页数 文件大小 规格书
8页 152K
描述
Programmable Unijunction Transistor

2N6027 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:not_compliant
HTS代码:8541.30.00.80风险等级:5.1
配置:SINGLEJEDEC-95代码:TO-92
JESD-30 代码:O-PBCY-T3JESD-609代码:e0
元件数量:1端子数量:3
封装主体材料:PLASTIC/EPOXY封装形状:ROUND
封装形式:CYLINDRICAL峰值电流最大值:2 µA
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
表面贴装:NO端子面层:TIN LEAD
端子形式:THROUGH-HOLE端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED触发设备类型:PROGRAMMABLE UJT
Valley Current-Min:50 µABase Number Matches:1

2N6027 数据手册

 浏览型号2N6027的Datasheet PDF文件第2页浏览型号2N6027的Datasheet PDF文件第3页浏览型号2N6027的Datasheet PDF文件第4页浏览型号2N6027的Datasheet PDF文件第5页浏览型号2N6027的Datasheet PDF文件第7页浏览型号2N6027的Datasheet PDF文件第8页 
2N6027, 2N6028  
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL  
H2A  
H2A  
H2B  
H2B  
H
W2  
H4  
H5  
T1  
L1  
H1  
W1  
W
L
T
T2  
F1  
F2  
D
P2  
P1  
P2  
P
Figure 13. Device Positioning on Tape  
Specification  
Millimeter  
Inches  
Symbol  
D
Item  
Min  
Max  
Min  
Max  
0.1496  
0.015  
0.0945  
.059  
0.1653  
3.8  
4.2  
Tape Feedhole Diameter  
D2  
F1, F2  
H
0.020  
0.110  
.156  
0.38  
2.4  
1.5  
8.5  
0
0.51  
2.8  
Component Lead Thickness Dimension  
Component Lead Pitch  
4.0  
Bottom of Component to Seating Plane  
Feedhole Location  
H1  
H2A  
H2B  
H4  
H5  
L
0.3346  
0
0.3741  
0.039  
0.051  
0.768  
0.649  
0.433  
9.5  
1.0  
Deflection Left or Right  
0
0
1.0  
Deflection Front or Rear  
0.7086  
0.610  
0.3346  
0.09842  
0.4921  
0.2342  
0.1397  
0.06  
18  
19.5  
16.5  
11  
Feedhole to Bottom of Component  
Feedhole to Seating Plane  
Defective Unit Clipped Dimension  
Lead Wire Enclosure  
15.5  
8.5  
2.5  
12.5  
5.95  
3.55  
0.15  
L1  
P
0.5079  
0.2658  
0.1556  
0.08  
12.9  
6.75  
3.95  
0.20  
1.44  
0.65  
19  
Feedhole Pitch  
P1  
Feedhole Center to Center Lead  
First Lead Spacing Dimension  
Adhesive Tape Thickness  
Overall Taped Package Thickness  
Carrier Strip Thickness  
P2  
T
T1  
0.0567  
0.027  
0.7481  
0.2841  
0.01968  
T2  
0.014  
0.6889  
0.2165  
.0059  
0.35  
17.5  
5.5  
.15  
W
Carrier Strip Width  
W1  
W2  
6.3  
Adhesive Tape Width  
0.5  
Adhesive Tape Position  
NOTES:  
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.  
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.  
3. Component lead to tape adhesion must meet the pull test requirements.  
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.  
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.  
6. No more than 1 consecutive missing component is permitted.  
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.  
8. Splices will not interfere with the sprocket feed holes.  
http://onsemi.com  
6

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