是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | DFN | 包装说明: | HVQCCN, |
针数: | 16 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.57 |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-XQCC-N16 |
JESD-609代码: | e3 | 长度: | 3 mm |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
2FAJ-M16R | BOURNS |
获取价格 |
Integrated Passive & Active Device using MLP | |
2FAK-C15R | BOURNS |
获取价格 |
Integrated Passive & Active Device using CSP | |
2FAK-C15RLF | BOURNS |
获取价格 |
Integrated Passive & Active Device using CSP | |
2FAL-M16R | BOURNS |
获取价格 |
Integrated Passive & Active Devices | |
2FAM-C5R | BOURNS |
获取价格 |
Integrated Passive & Active Device using CSP | |
2FAM-C5RLF | BOURNS |
获取价格 |
Integrated Passive & Active Device using CSP | |
2FAN-C5R | BOURNS |
获取价格 |
Integrated Passive & Active Device using CSP | |
2FAN-C5RLF | BOURNS |
获取价格 |
Integrated Passive & Active Device using CSP | |
2FAP-M12R | BOURNS |
获取价格 |
Consumer Circuit, PDSO12, 3 X 1.40 MM, ROHS COMPLIANT, DFN-12 | |
2FB10F | ADAM-TECH |
获取价格 |
FUTURE BUS 2.00mm CENTERLINE EIA STANDARD |