27LV64
64K (8K x 8) Low-Voltage CMOS EPROM
FEATURES
PACKAGE TYPES
DIP/SOIC
• Wide voltage range 3.0V to 5.5V
• High speed performance
VPP • 1
28 VCC
27 PGM
26 NC
25 A8
24 A9
23 A11
22 OE
21 A10
20 CE
19 O7
18 O6
17 O5
16 O4
15 O3
- 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
- 8 mA active current at 3.0V
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
2
3
4
5
6
- 20 mA active current at 5.5V
7
- 100 µA standby current
8
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed “express” programming algorithm
• Organized 8K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
9
10
11
12
13
VSS 14
PLCC
- 32-pin PLCC Package
- 28-pin SOIC package
- Tape and reel
5
29
A6
A8
A9
A11
NC
OE
A10
CE
O7
• Available for the following temperature ranges:
6
28
A5
A4
A3
A2
A1
A0
NC
O0
- Commercial:
- Industrial:
0˚C to +70˚C
7
27
8
26
-40˚C to +85˚C
9
25
10
11
12
13
24
23
DESCRIPTION
22
21
O6
The Microchip Technology Inc. 27LV64 is a low-voltage
(3.0 volt) CMOS EPROM designed for battery powered
applications. The device is organized as 8K x 8 (8K-
Byte) non-volatile memory product. The 27LV64 con-
sumes only 8mA maximum of active current during a
3.0 volt read operation therefore improving battery per-
formance. This device is designed for very low voltage
applications where conventional 5.0 volt only EPROMs
can not be used. Accessing individual bytes from an
address transition or from power-up (chip enable pin
going low) is accomplished in less than 200 ns at
3.0V.This device allows system designers the ability to
use low voltage non-volatile memory with today’s low
voltage microprocessors and peripherals in battery
powered applications.
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC or SOIC packaging is available. Tape
and reel packaging is also available for PLCC or SOIC
packages.
1996 Microchip Technology Inc.
DS11024E-page 1
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