Obsolete Device
27LV256
256K (32K x 8) Low-Voltage CMOS EPROM
FEATURES
PACKAGE TYPES
PDIP
• Wide voltage range 3.0V to 5.5V
• High speed performance
VPP • 1
28 VCC
27 A14
26 A13
25 A8
24 A9
23 A11
22 OE
21 A10
20 CE
19 O7
18 O6
17 O5
16 O4
15 O3
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
2
3
4
- 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
- 8 mA Active current at 3.0V
5
6
7
8
- 20 mA Active current at 5.5V
9
10
11
12
13
- 100 µA Standby current
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed “Express” programming algorithm
• Organized 32K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
VSS 14
PLCC
5
29
A6
A8
6
28
A5
A4
A3
A2
A1
A0
NC
O0
A9
7
27
A11
- 32-pin PLCC package
8
26
25
24
23
22
21
NC
OE
A10
CE
O7
O6
9
- 28-pin SOIC package
10
11
12
13
- Tape and reel
• Data Retention > 200 years
• Available for the following temperature ranges:
- Commercial:
- Industrial:
0°C to +70°C
-40°C to +85°C
SOIC
VPP
A12
A7
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A14
A13
A8
DESCRIPTION
2
3
A6
4
The Microchip Technology Inc. 27LV256 is a low volt-
age (3.0 volt) CMOS EPROM designed for battery
powered applications. The device is organized as a
32K x 8 (32K-Byte) non-volatile memory product. The
27LV256 consumes only 8 mA maximum of active cur-
rent during a 3.0 volt read operation therefore improv-
ing battery performance. This device is designed for
very low voltage applications where conventional 5.0
volt only EPROMS can not be used. Accessing individ-
ual bytes from an address transition or from power-up
(chip enable pin going low) is accomplished in less than
200 ns at 3.0V. This device allows systems designers
the ability to use low voltage non-volatile memory with
today’s' low voltage microprocessors and peripherals in
battery powered applications.
A5
5
A9
A4
6
A11
OE
A10
CE
O7
A3
7
A2
8
A1
9
A0
10
11
12
13
14
O0
O1
O2
VSS
O6
O5
O4
O3
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC or SOIC packaging is available. Tape
and reel packaging is also available for PLCC or SOIC
packages.
2004 Microchip Technology Inc.
DS11020H-page 1