Datasheet > 27C256-30I/SO

27C256-30I/SO

更新时间： 2024-12-01 03:55:51

品牌	Logo	应用领域
美国微芯 - MICROCHIP		可编程只读存储器电动程控只读存储器
页数	文件大小	规格书
10页	132K
描述
256K (32K x 8) Low-Voltage CMOS EPROM

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中文翻译

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数据手册

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27C256-30I/SO 数据手册

Obsolete Device

27LV256

256K (32K x 8) Low-Voltage CMOS EPROM

FEATURES

PACKAGE TYPES

PDIP

• Wide voltage range 3.0V to 5.5V

• High speed performance

V_PP• 1

28 V_CC

27 A14

26 A13

25 A8

24 A9

23 A11

22 OE

21 A10

20 CE

19 O7

18 O6

17 O5

16 O4

15 O3

A12

- 200 ns access time available at 3.0V

• CMOS Technology for low power consumption

- 8 mA Active current at 3.0V

- 20 mA Active current at 5.5V

- 100 µA Standby current

• Factory programming available

• Auto-insertion-compatible plastic packages

• Auto ID aids automated programming

• Separate chip enable and output enable controls

• High speed “Express” programming algorithm

• Organized 32K x 8: JEDEC standard pinouts

- 28-pin Dual-in-line package

V_SS14

PLCC

A11

- 32-pin PLCC package

A10

- 28-pin SOIC package

- Tape and reel

• Data Retention > 200 years

• Available for the following temperature ranges:

- Commercial:

- Industrial:

0°C to +70°C

-40°C to +85°C

SOIC

VPP

A12

VCC

A14

A13

DESCRIPTION

The Microchip Technology Inc. 27LV256 is a low volt-

age (3.0 volt) CMOS EPROM designed for battery

powered applications. The device is organized as a

32K x 8 (32K-Byte) non-volatile memory product. The

27LV256 consumes only 8 mA maximum of active cur-

rent during a 3.0 volt read operation therefore improv-

ing battery performance. This device is designed for

very low voltage applications where conventional 5.0

volt only EPROMS can not be used. Accessing individ-

ual bytes from an address transition or from power-up

(chip enable pin going low) is accomplished in less than

200 ns at 3.0V. This device allows systems designers

the ability to use low voltage non-volatile memory with

today’s' low voltage microprocessors and peripherals in

battery powered applications.

A11

A10

V^SS

A complete family of packages is offered to provide the

most flexibility in applications. For surface mount appli-

cations, PLCC or SOIC packaging is available. Tape

and reel packaging is also available for PLCC or SOIC

packages.

2004 Microchip Technology Inc.

DS11020H-page 1

12 3 4 5 6 7...10

中文翻译

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与27C256-30I/SO相关器件

型号	品牌	获取价格	描述	数据表
27C256-45	Macronix	获取价格	256K-BIT [32K x 8] CMOS EPROM
27C256-55	Macronix	获取价格	256K-BIT [32K x 8] CMOS EPROM
27C256-70	Macronix	获取价格	256K-BIT [32K x 8] CMOS EPROM
27C256-90	Macronix	获取价格	256K-BIT [32K x 8] CMOS EPROM
27C256-90/J	ETC	获取价格	x8 EPROM
27C256-90/K	ETC	获取价格	x8 EPROM
27C256-90/L	MICROCHIP	获取价格	256K (32K x 8) CMOS EPROM
27C256-90/P	MICROCHIP	获取价格	256K (32K x 8) CMOS EPROM
27C256-90/SO	MICROCHIP	获取价格	256K (32K x 8) CMOS EPROM
27C256-90/TS	ETC	获取价格	x8 EPROM

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