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24LC16BT-I/MSG PDF预览

24LC16BT-I/MSG

更新时间: 2024-10-28 21:17:47
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟光电二极管内存集成电路
页数 文件大小 规格书
42页 537K
描述
2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8

24LC16BT-I/MSG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.14
其他特性:1 MILLION ERASE/WRITE CYCLES最大时钟频率 (fCLK):0.4 MHz
数据保留时间-最小值:200耐久性:1000000 Write/Erase Cycles
I2C控制字节:1010MMMRJESD-30 代码:S-PDSO-G8
JESD-609代码:e3长度:3 mm
内存密度:16384 bit内存集成电路类型:EEPROM
内存宽度:8湿度敏感等级:1
功能数量:1端子数量:8
字数:2048 words字数代码:2000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:2KX8
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP8,.19封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:SERIAL
峰值回流温度(摄氏度):260电源:2/5 V
认证状态:Not Qualified座面最大高度:1.1 mm
串行总线类型:I2C最大待机电流:0.000001 A
子类别:EEPROMs最大压摆率:0.003 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:3 mm
最长写入周期时间 (tWC):5 ms写保护:HARDWARE
Base Number Matches:1

24LC16BT-I/MSG 数据手册

 浏览型号24LC16BT-I/MSG的Datasheet PDF文件第2页浏览型号24LC16BT-I/MSG的Datasheet PDF文件第3页浏览型号24LC16BT-I/MSG的Datasheet PDF文件第4页浏览型号24LC16BT-I/MSG的Datasheet PDF文件第5页浏览型号24LC16BT-I/MSG的Datasheet PDF文件第6页浏览型号24LC16BT-I/MSG的Datasheet PDF文件第7页 
24AA00/24LC00/24C00  
24AA014/24LC014  
24AA02/24LC02B  
24AA01/24LC01B  
24C01C/24C02C  
24AA025/24LC025  
24AA024/24LC024  
24AA04/24LC04B  
24AA16/24LC16B  
24AA08/24LC08B  
24AA32A/24LC32A  
24AA128/24LC128/24FC128  
24AA512/24LC512/24FC512  
24AA64/24LC64/24FC64  
24AA256/24LC256/24FC256 24AA1025/24LC1025/24FC1025  
I2CSerial EEPROM Family Data Sheet  
Features:  
Description:  
• 128-bit through 1024 Kbit Devices  
The Microchip Technology Inc. 24CXX, 24LCXX,  
24AAXX and 24FCXX (24XX*) devices are a family of  
128-bit through 1024 Kbit Electrically Erased PROMs.  
The devices are organized in blocks of x8-bit memory  
with 2-wire serial interfaces. Low-voltage design  
permits operation down to 1.7V (for 24AAXX devices),  
with standby and active currents of only 1 μA and 1  
mA, respectively. Devices 1 Kbit and larger have page  
write capability. Parts having functional address lines  
allow connection of up to 8 devices on the same bus.  
The 24XX family is available in the standard 8-pin  
PDIP, surface mount SOIC, TSSOP and MSOP pack-  
ages. Most 128-bit through 16 Kbit devices are also  
available in the 5-lead SOT-23 package. DFN  
packages (2x3mm or 5x6mm) are also available. All  
packages are Pb-free (Matte Tin) finish.  
• Single Supply with Operation Down to 1.7V for  
24AAXX Devices  
• Low-Power CMOS Technology:  
- 1 mA active current, typical  
- 1 μA standby current, typical (I-temp)  
• 2-Wire Serial Interface Bus, I2C™ Compatible  
• Schmitt Trigger Inputs for Noise Suppression  
• Output Slope Control to Eliminate Ground Bounce  
• 400 kHz (2.5V): 24LCXX and 24AAXX  
• 1 MHz (2.5V) and 400 kHz (1.7V): 24FCXX  
• Self-Timed Write Cycle (including Auto-Erase)  
• Page Write Buffer  
• Hardware Write-Protect Available on Most  
Devices  
• Factory Programming (QTP) Available  
• ESD Protection >4,000V  
Note:  
This document is an overview. For  
detailed specifications, please consult the  
individual product data sheet, available at  
www.microchip.com.  
• 1 Million Erase/Write Cycles  
• Data Retention >200 years  
• 8-lead PDIP, SOIC, TSSOP and MSOP Packages  
• 5-lead SOT-23 Package (Most 1-16 Kbit Devices)  
• 8-lead 2x3mm and 5x6mm DFN Packages  
Available  
*24XX is used in this document as a generic part  
number for 24 series devices in this data sheet.  
24XX64, for example, represents all voltages of the 64  
Kbit device.  
• Pb-Free and RoHS Compliant  
• Available for Extended Temperature Ranges:  
- Industrial (I): -40°C to +85°C  
- Automotive (E): -40°C to +125°C  
(1)  
Package Types  
TSSOP/MSOP(2)  
SOT-23-5  
(24XX00)  
PDIP/SOIC  
A0  
A1  
1
2
3
4
8
7
6
5
VCC  
1
2
3
4
8
7
6
5
A0  
A1  
VCC  
(3)  
VCC  
NC  
1
2
5
SCL  
VSS  
(3)  
WP  
WP  
A2  
SCL  
SDA  
A2  
SCL  
SDA  
SDA  
VSS  
VSS  
3
4
SOT-23-5  
(all except 24XX00)  
Note 1: Pins A0, A1, A2 and WP are not used by some  
devices (no internal connections). See Table 1-1,  
Device Selection Table, for details.  
DFN  
1
2
3
4
A0  
A1  
8
7
6
5
VCC  
(3)  
WP  
1
5
4
SCL  
2: Pins A0 and A1 are no-connects for the 24XX128  
WP  
and 24XX256 MSOP devices.  
2
3
VSS  
A2  
SCL  
SDA  
3: Pin 7 is “not used” for 24XX00, 24XX025 and  
VSS  
24C01C.  
VCC  
SDA  
© 2007 Microchip Technology Inc.  
DS21930C-page 1  

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