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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 2266490-2 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2266490-5 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2266490-6 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 2266490-7 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
| 22-665000-00-P | ARIES |
获取价格 |
SOWI-to-SOIC Adapter |
|
| 22-66-5040 | MOLEX |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 22-66-5072 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 22-66-5160 | MOLEX |
获取价格 |
Board Connector, 11 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 22-66-5170 | MOLEX |
获取价格 |
Board Connector, 11 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 2266542-1 | TE |
获取价格 |
IT IS SUBJECT TO CHANGE AND THE CONTROLLING ENGINEERING ORGANIZATION |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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