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1PMT5934BE3/TR13 PDF预览

1PMT5934BE3/TR13

更新时间: 2024-11-13 10:34:35
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管
页数 文件大小 规格书
3页 119K
描述
DIODE ZENER 24V 3W DO216AA

1PMT5934BE3/TR13 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:TransferredReach Compliance Code:compliant
风险等级:5.76二极管类型:ZENER DIODE
峰值回流温度(摄氏度):NOT SPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED

1PMT5934BE3/TR13 数据手册

 浏览型号1PMT5934BE3/TR13的Datasheet PDF文件第2页浏览型号1PMT5934BE3/TR13的Datasheet PDF文件第3页 
1PMT5913Be3 thru 1PMT5956Be3  
E
TM  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This surface mountable 3.0 W Zener diode series in the JEDEC DO-216  
package is similar in electrical features to the JEDEC registered 1N5913B  
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection  
for applications requiring low profile and high-density mounting that are also  
RoHS Compliant. When properly heat sunk, these zener diodes provide  
power-handling capabilities only found in larger packages. In addition to its  
size advantages, Powermite® package features include a full metallic  
bottom that eliminates the possibility of solder flux entrapment during  
assembly, and a unique locking tab acts as an integral heat sink. Its  
innovative design makes this device ideal for use with automatic insertion  
equipment.  
DO-216  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Very low profile surface mount package (1.1 mm)  
Integral Heat Sink Locking Tabs  
Compatible with automatic insertion equipment  
Full metallic bottom eliminates flux entrapment  
RoHS Compliant  
Zener voltage 3.3 to 200 Volts  
Low reverse leakage  
Tight tolerance available  
Regulates voltage over a broad operating current  
and temperature range  
Wide selection from 3.3 to 200 V  
Flexible axial-lead mounting terminals  
Nonsensitive to ESD  
Moisture classification is Level 1 per IPC/JEDEC  
J-STD-020B with no dry pack required  
ESD Rating of >16kV per human body model  
MAXIMUM RATINGS  
Junction and storage temperatures: -55°C to +150°C  
DC power dissipation: 3.0 watt with case bottom (TAB  
1) 60°C (also see derating in Figure 1).  
MECHANICAL AND PACKAGING  
Terminals: Annealed matte-Tin plating over copper  
and readily solderable per MIL-STD-750 method 2026  
(consult factory for Tin-Lead plating)  
Polarity: Cathode designated by TAB 1 (backside)  
Case: Molded epoxy package meets UL94V-0  
Marking: Last three numerical digits of part number  
(see device marking code in Electrical Characteristics  
table below with dot “•” suffix for RoHS Compliant)  
Weight: 0.016 gram (approximate)  
Forward voltage @200 mA: 1.2 volts (maximum)  
Thermal Resistance: 30 ºC/W junction to Case bottom  
(Tab 1), or 230ºC/W junction to ambient when mounted  
on FR4 PC board (1 oz Cu) with recommended  
footprint (see last page).  
Steady-State Power: 3.0 watts at TC < 60oC, or 0.54  
watts at TA = 25ºC when mounted on FR4 PC board  
and recommended footprint as described for thermal  
resistance (see Figure 1 and last page)  
Tape & Reel option: Standard per EIA-481-B  
7 inch reel 3,000 pieces  
13 inch reel 12,000 pieces  
Solder Temperatures: 260 ºC for 10 s (max)  
ELECTRICAL CHARACTERISTICS @ TL = 30oC  
Zener  
Test  
Dynamic  
Knee  
Knee  
Maximum  
Reverse  
Voltage  
Maximum  
Zener  
Current  
IZM  
Voltage  
Current  
Impedance  
Current Impedance Reverse  
Current  
IZK  
Device  
Marking  
(4)  
Microsemi  
Number  
VZ  
(1)  
VOLTS  
IZT  
ZZT  
(2)  
OHMS  
ZZK  
IR  
VR  
(3)  
mA  
mA  
mA  
OHMS  
VOLTS  
μAdc  
100  
75  
25  
5
5
5
5
5
1PMT5913B  
1PMT5914B  
1PMT5915B  
1PMT5916B  
1PMT5917B  
1PMT5918B  
1PMT5919B  
1PMT5920B  
913•  
914•  
915•  
916•  
917•  
918•  
919•  
920•  
3.3  
3.6  
3.9  
4.3  
4.7  
5.1  
5.6  
6.2  
113.6  
104.2  
96.1  
87.2  
79.8  
73.5  
66.9  
60.5  
10  
9.0  
7.5  
6.0  
5.0  
4.0  
2.0  
2.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
500  
500  
500  
500  
500  
350  
250  
200  
1.0  
1.0  
1.0  
1.0  
1.5  
2.0  
3.0  
4.0  
749.1  
686.4  
633.6  
547.2  
526.4  
481.8  
432.3  
397.7  
Copyright © 2005  
6-19-2005 REV H  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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