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1P1G126QYEPR PDF预览

1P1G126QYEPR

更新时间： 2024-09-14 21:14:59
品牌 Logo 应用领域
德州仪器 - TI 驱动输出元件逻辑集成电路
页数 文件大小 规格书
14页 334K
描述
LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PBGA5, DSBGA-5

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1P1G126QYEPR 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：BGA包装说明：VFBGA,
针数：5Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.63
系列：LVC/LCX/ZJESD-30 代码：R-PBGA-B5
长度：1.4 mm逻辑集成电路类型：BUS DRIVER
湿度敏感等级：1位数：1
功能数量：1端口数量：2
端子数量：5最高工作温度：125 °C
最低工作温度：-40 °C输出特性：3-STATE
输出极性：TRUE封装主体材料：PLASTIC/EPOXY
封装代码：VFBGA封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度（摄氏度）：260
传播延迟（tpd）：8 ns认证状态：Not Qualified
座面最大高度：0.5 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：AUTOMOTIVE端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：0.9 mm
Base Number Matches：1

1P1G126QYEPR 数据手册

 浏览型号1P1G126QYEPR的Datasheet PDF文件第2页浏览型号1P1G126QYEPR的Datasheet PDF文件第3页浏览型号1P1G126QYEPR的Datasheet PDF文件第4页浏览型号1P1G126QYEPR的Datasheet PDF文件第5页浏览型号1P1G126QYEPR的Datasheet PDF文件第6页浏览型号1P1G126QYEPR的Datasheet PDF文件第7页 
SN74LVC1G126  
SINGLE BUS BUFFER GATE  
WITH 3-STATE OUTPUT  
SCES224K – APRIL 1999 – REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
Supports 5-V V  
Inputs Accept Voltages to 5.5 V  
Operation  
CC  
1
2
3
5
4
OE  
A
GND  
V
Y
CC  
Max t of 3.7 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2
1 5  
GND  
A
OE  
Y
V
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single bus buffer gate is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G126 is a single line driver with a 3-state output. The output is disabled when the output-enable  
(OE) input is low.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
†
PACKAGE  
T
A
‡
MARKING  
NanoStar™ – WCSP (DSBGA)  
SN74LVC1G126YEAR  
SN74LVC1G126YZAR  
SN74LVC1G126YEPR  
SN74LVC1G126YZPR  
0.17-mm Small Bump – YEA  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
Reel of 3000  
_ _ _CN_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G126DBVR  
SN74LVC1G126DBVT  
SN74LVC1G126DCKR  
SN74LVC1G126DCKT  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
C26_  
CN_  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
Copyright © 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...14

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1P1G126QYEPR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G126YZPR TI

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