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1N4148UBCA PDF预览

1N4148UBCA

更新时间： 2024-01-26 18:42:56
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
19页 104K
描述
PERFORMANCE SPECIFICATION

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1N4148UBCA 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8541.10.00.70风险等级：5.76
配置：SINGLE二极管类型：RECTIFIER DIODE
最大正向电压 (VF)：0.715 V最大非重复峰值正向电流：2 A
元件数量：1最高工作温度：150 °C
最大输出电流：0.15 A最大重复峰值反向电压：75 V
最大反向恢复时间：0.004 µs子类别：Rectifier Diodes
表面贴装：YESBase Number Matches：1

1N4148UBCA 数据手册

 浏览型号1N4148UBCA的Datasheet PDF文件第5页浏览型号1N4148UBCA的Datasheet PDF文件第6页浏览型号1N4148UBCA的Datasheet PDF文件第7页浏览型号1N4148UBCA的Datasheet PDF文件第9页浏览型号1N4148UBCA的Datasheet PDF文件第10页浏览型号1N4148UBCA的Datasheet PDF文件第11页 
MIL-PRF-19500/116L  
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited  
herein the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws  
and regulations unless a specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 General. The requirements for acquiring the product described herein shall consist of this document and  
MIL-PRF-19500.  
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a  
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)  
before contract award (see 4.2 and 6.3).  
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as  
specified in MIL-PRF-19500 and as follows.  
Vfr  
Forward recovery voltage. Specified maximum forward voltage used to determine forward recovery  
time.  
LS  
UB  
UR  
Lead spacing distance between device body and electrical/mechanical contact on lead.  
Hermetic unleaded 3 terminal (LCC, Leadless Chip Carrier) package type.  
Unleaded round package type designation.  
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in  
MIL-PRF-19500, and on figures 1, 2, 3, 4, and 5 herein.  
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.  
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).  
3.4.2 Diode construction. All devices (except UB version) shall be metallurgically bonded double plug construction  
in accordance with the requirements of category I, II, or III (see MIL-PRF-19500). The UB package shall be wire  
bonded, eutectically mounted devices.  
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance  
characteristics are as specified in 1.3, 1.4, and table I.  
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and  
4.4.3 herein.  
3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, marking  
may be omitted from the body, but shall be retained on the initial container.  
3.7.1 UR devices. "UR" devices shall be marked with a cathode band only. Initial container package marking shall  
be in accordance with MIL-PRF-19500.  
3.7.2 UB devices. The part number may be reduced to J4148, JX4148, or JV4148. Manufacturers identification  
and date code shall be marked on the devices.  
3.7.3 UBR devices. The part number may be reduced to J4148, JX4148, or JV4148. Manufacturers identification  
and date code shall be marked on the devices.  
3.8 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end. No color  
coding will be permitted. UB packages do not require polarity marking.  
3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and  
shall be free from other defects that will affect life, serviceability, or appearance.  
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