是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | BGA, BGA780,28X28,40 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.45 |
JESD-30 代码: | S-PBGA-B780 | 长度: | 29 mm |
输入次数: | 360 | 逻辑单元数量: | 320000 |
输出次数: | 360 | 端子数量: | 780 |
最高工作温度: | 100 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA780,28X28,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 0.9 V | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 3.35 mm |
子类别: | Field Programmable Gate Arrays | 最大供电电压: | 0.93 V |
最小供电电压: | 0.87 V | 标称供电电压: | 0.9 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 29 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
10AS032H3F34I2SG | INTEL |
获取价格 |
Field Programmable Gate Array, 320000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB | |
10AS032H4F34E3LG | INTEL |
获取价格 |
Field Programmable Gate Array, 320000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB | |
10AS-04 | MSYSTEM |
获取价格 |
High-density Signal Conditioners 10-RACK | |
10AS-04/C01 | MSYSTEM |
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High-density Signal Conditioners 10-RACK | |
10AS-04/C02 | MSYSTEM |
获取价格 |
High-density Signal Conditioners 10-RACK | |
10AS-04/C03 | MSYSTEM |
获取价格 |
High-density Signal Conditioners 10-RACK | |
10AS048K5F35E3SG | INTEL |
获取价格 |
Field Programmable Gate Array, 480000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB | |
10AS-05 | MSYSTEM |
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High-density Signal Conditioners 10-RACK | |
10AS-05/C01 | MSYSTEM |
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High-density Signal Conditioners 10-RACK | |
10AS-05/C02 | MSYSTEM |
获取价格 |
High-density Signal Conditioners 10-RACK |