08055C103KAT9A

更新时间： 2024-01-12 15:30:31

品牌	Logo	应用领域
京瓷/艾维克斯 - KYOCERA AVX		电容器固定电容器
页数	文件大小	规格书
20页	339K
描述
General Specifications

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技术参数
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08055C103KAT9A 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	包装说明：	, 0805
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8532.24.00.20	Factory Lead Time：	28 weeks
风险等级：	5.32	Is Samacsys：	N
电容：	0.01 µF	电容器类型：	CERAMIC CAPACITOR
介电材料：	CERAMIC	高度：	0.94 mm
JESD-609代码：	e3	长度：	2.01 mm
安装特点：	SURFACE MOUNT	多层：	Yes
负容差：	10%	端子数量：	2
最高工作温度：	125 °C	最低工作温度：	-55 °C
封装形状：	RECTANGULAR PACKAGE	封装形式：	SMT
包装方法：	BULK	正容差：	10%
额定（直流）电压（URdc）：	50 V	尺寸代码：	0805
表面贴装：	YES	温度特性代码：	X7R
温度系数：	15% ppm/ °C	端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：	WRAPAROUND	宽度：	1.25 mm
Base Number Matches：	1

08055C103KAT9A 数据手册

Surface Mounting Guide

MLC Chip Capacitors

POST SOLDER HANDLING

COMMON CAUSES OF

Once SMP components are soldered to the board, any

bending or flexure of the PCB applies stresses to the sol-

dered joints of the components. For leaded devices, the

stresses are absorbed by the compliancy of the metal leads

and generally don’t result in problems unless the stress is

large enough to fracture the soldered connection.

MECHANICAL CRACKING

The most common source for mechanical stress is board

depanelization equipment, such as manual breakapart, v-

cutters and shear presses. Improperly aligned or dull cutters

may cause torqueing of the PCB resulting in flex stresses

being transmitted to components near the board edge.

Another common source of flexural stress is contact during

parametric testing when test points are probed. If the PCB

is allowed to flex during the test cycle, nearby ceramic

capacitors may be broken.

Ceramic capacitors are more susceptible to such stress

because they don’t have compliant leads and are brittle in

nature. The most frequent failure mode is low DC resistance

or short circuit. The second failure mode is significant loss

of capacitance due to severing of contact between sets of

the internal electrodes.

A third common source is board to board connections at

vertical connectors where cables or other PCBs are con-

nected to the PCB. If the board is not supported during the

plug/unplug cycle, it may flex and cause damage to nearby

components.

Cracks caused by mechanical flexure are very easily identi-

fied and generally take one of the following two general

forms:

Special care should also be taken when handling large (>6"

on a side) PCBs since they more easily flex or warp than

smaller boards.

REWORKING OF MLCs

Thermal shock is common in MLCs that are manually

attached or reworked with a soldering iron. AVX strongly

recommends that any reworking of MLCs be done with hot

air reflow rather than soldering irons. It is practically impossi-

ble to cause any thermal shock in ceramic capacitors when

using hot air reflow.

Type A:

Angled crack between bottom of device to top of solder joint.

However direct contact by the soldering iron tip often caus-

es thermal cracks that may fail at a later date. If rework by

soldering iron is absolutely necessary, it is recommended

that the wattage of the iron be less than 30 watts and the

tip temperature be <300ºC. Rework should be performed

by applying the solder iron tip to the pad and not directly

contacting any part of the ceramic capacitor.

Type B:

Fracture from top of device to bottom of device.

Mechanical cracks are often hidden underneath the termi-

nation and are difficult to see externally. However, if one end

termination falls off during the removal process from PCB,

this is one indication that the cause of failure was excessive

mechanical stress due to board warping.

1...16 17 181920

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