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08055C103KAT9A PDF预览

08055C103KAT9A

更新时间： 2024-02-22 00:50:10
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX 电容器固定电容器
页数 文件大小 规格书
20页 339K
描述
General Specifications

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中文翻译

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08055C103KAT9A 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete包装说明：, 0805
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20Factory Lead Time：28 weeks
风险等级：5.32Is Samacsys：N
电容：0.01 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：0.94 mm
JESD-609代码：e3长度：2.01 mm
安装特点：SURFACE MOUNT多层：Yes
负容差：10%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：BULK正容差：10%
额定（直流）电压（URdc）：50 V尺寸代码：0805
表面贴装：YES温度特性代码：X7R
温度系数：15% ppm/ °C端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：WRAPAROUND宽度：1.25 mm
Base Number Matches：1

08055C103KAT9A 数据手册

 浏览型号08055C103KAT9A的Datasheet PDF文件第14页浏览型号08055C103KAT9A的Datasheet PDF文件第15页浏览型号08055C103KAT9A的Datasheet PDF文件第16页浏览型号08055C103KAT9A的Datasheet PDF文件第18页浏览型号08055C103KAT9A的Datasheet PDF文件第19页浏览型号08055C103KAT9A的Datasheet PDF文件第20页 
Surface Mounting Guide  
MLC Chip Capacitors  
REFLOW SOLDERING  
Case Size  
0402  
D1  
D2  
D3  
D4  
D5  
D2  
1.70 (0.07)  
2.30 (0.09)  
3.00 (0.12)  
4.00 (0.16)  
4.00 (0.16)  
5.60 (0.22)  
5.60 (0.22)  
5.60 (0.22)  
6.60 (0.26)  
6.60 (0.26)  
0.60 (0.02)  
0.80 (0.03)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04))  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
0.50 (0.02)  
0.70 (0.03)  
1.00 (0.04)  
2.00 (0.09)  
2.00 (0.09)  
3.60 (0.14)  
3.60 (0.14)  
3.60 (0.14)  
4.60 (0.18)  
4.60 (0.18)  
0.60 (0.02)  
0.80 (0.03)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
1.00 (0.04)  
0.50 (0.02)  
0.75 (0.03)  
1.25 (0.05)  
1.60 (0.06)  
2.50 (0.10)  
2.00 (0.08)  
3.00 (0.12)  
6.35 (0.25)  
5.00 (0.20)  
6.35 (0.25)  
0603  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
D1  
D3  
D4  
D5  
2225  
Dimensions in millimeters (inches)  
Component Pad Design  
Component pads should be designed to achieve good  
solder filets and minimize component movement during  
reflow soldering. Pad designs are given below for the most  
common sizes of multilayer ceramic capacitors for both  
wave and reflow soldering. The basis of these designs is:  
• Pad width equal to component width. It is permissible to  
decrease this to as low as 85ꢀ of component width but it  
is not advisable to go below this.  
• Pad overlap 0.5mm beneath component.  
• Pad extension 0.5mm beyond components for reflow and  
1.0mm for wave soldering.  
WAVE SOLDERING  
D2  
Case Size  
0603  
D1  
D2  
D3  
D4  
D5  
3.10 (0.12)  
4.00 (0.15)  
5.00 (0.19)  
5.00 (0.19)  
1.20 (0.05)  
1.50 (0.06)  
1.50 (0.06)  
1.50 (0.06)  
0.70 (0.03)  
1.00 (0.04)  
2.00 (0.09)  
2.00 (0.09)  
1.20 (0.05)  
1.50 (0.06)  
1.50 (0.06)  
1.50 (0.06)  
0.75 (0.03)  
1.25 (0.05)  
1.60 (0.06)  
2.50 (0.10)  
D1  
D3  
D4  
0805  
1206  
1210  
D5  
Dimensions in millimeters (inches)  
Component Spacing  
Preheat & Soldering  
For wave soldering components, must be spaced sufficiently  
far apart to avoid bridging or shadowing (inability of solder  
to penetrate properly into small spaces). This is less impor-  
tant for reflow soldering but sufficient space must be  
allowed to enable rework should it be required.  
The rate of preheat should not exceed 4°C/second to  
prevent thermal shock. A better maximum figure is about  
2°C/second.  
For capacitors size 1206 and below, with a maximum  
thickness of 1.25mm, it is generally permissible to allow a  
temperature differential from preheat to soldering of 150°C.  
In all other cases this differential should not exceed 100°C.  
For further specific application or process advice, please  
consult AVX.  
Cleaning  
≥1.5mm (0.06)  
≥1mm (0.04)  
Care should be taken to ensure that the capacitors are  
thoroughly cleaned of flux residues especially the space  
beneath the capacitor. Such residues may otherwise  
become conductive and effectively offer a low resistance  
bypass to the capacitor.  
≥1mm (0.04)  
Ultrasonic cleaning is permissible, the recommended  
conditions being 8 Watts/litre at 20-45 kHz, with a process  
cycle of 2 minutes vapor rinse, 2 minutes immersion in the  
ultrasonic solvent bath and finally 2 minutes vapor rinse.  
57  
1...14151617181920

中文翻译

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