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08055C103KAT9A PDF预览

08055C103KAT9A

更新时间： 2024-02-26 04:57:00
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京瓷/艾维克斯 - KYOCERA AVX 电容器固定电容器
页数 文件大小 规格书
20页 339K
描述
General Specifications

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中文翻译

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08055C103KAT9A 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete包装说明：, 0805
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20Factory Lead Time：28 weeks
风险等级：5.32Is Samacsys：N
电容：0.01 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：0.94 mm
JESD-609代码：e3长度：2.01 mm
安装特点：SURFACE MOUNT多层：Yes
负容差：10%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：BULK正容差：10%
额定（直流）电压（URdc）：50 V尺寸代码：0805
表面贴装：YES温度特性代码：X7R
温度系数：15% ppm/ °C端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：WRAPAROUND宽度：1.25 mm
Base Number Matches：1

08055C103KAT9A 数据手册

 浏览型号08055C103KAT9A的Datasheet PDF文件第14页浏览型号08055C103KAT9A的Datasheet PDF文件第15页浏览型号08055C103KAT9A的Datasheet PDF文件第16页浏览型号08055C103KAT9A的Datasheet PDF文件第17页浏览型号08055C103KAT9A的Datasheet PDF文件第19页浏览型号08055C103KAT9A的Datasheet PDF文件第20页 
Surface Mounting Guide  
MLC Chip Capacitors  
General  
APPLICATION NOTES  
Surface mounting chip multilayer ceramic capacitors  
are designed for soldering to printed circuit boards or other  
substrates. The construction of the components is such that  
they will withstand the time/temperature profiles used in both  
wave and reflow soldering methods.  
Storage  
Good solderability is maintained for at least twelve months,  
provided the components are stored in their “as received”  
packaging at less than 40°C and 70ꢀ RH.  
Solderability  
Handling  
Terminations to be well soldered after immersion in a 60/40  
tin/lead solder bath at 235 5°C for 2 1 seconds.  
Chip multilayer ceramic capacitors should be handled with  
care to avoid damage or contamination from perspiration  
and skin oils. The use of tweezers or vacuum pick ups  
is strongly recommended for individual components. Bulk  
handling should ensure that abrasion and mechanical shock  
are minimized. Taped and reeled components provides the  
ideal medium for direct presentation to the placement  
machine. Any mechanical shock should be minimized during  
handling chip multilayer ceramic capacitors.  
Leaching  
Terminations will resist leaching for at least the immersion  
times and conditions shown below.  
Solder  
Tin/Lead/Silver Temp. °C  
60/40/0 260  
Solder  
Immersion Time  
Seconds  
Termination Type  
Nickel Barrier  
5
30  
1
Preheat  
It is important to avoid the possibility of thermal shock during  
soldering and carefully controlled preheat is therefore  
required. The rate of preheat should not exceed 4°C/second  
and a target figure 2°C/second is recommended. Although  
an 80°C to 120°C temperature differential is preferred,  
recent developments allow a temperature differential  
between the component surface and the soldering temper-  
ature of 150°C (Maximum) for capacitors of 1210 size and  
below with a maximum thickness of 1.25mm. The user is  
cautioned that the risk of thermal shock increases as chip  
size or temperature differential increases.  
Recommended Soldering Profiles  
Reflow  
300  
Natural  
Cooling  
Preheat  
250  
200  
220°C  
to  
250°C  
150  
100  
50  
Soldering  
Mildly activated rosin fluxes are preferred. The minimum  
amount of solder to give a good joint should be used.  
Excessive solder can lead to damage from the stresses  
caused by the difference in coefficients of expansion  
between solder, chip and substrate. AVX terminations are  
suitable for all wave and reflow soldering systems. If hand  
soldering cannot be avoided, the preferred technique is the  
utilization of hot air soldering tools.  
0
1min  
(Minimize soldering time)  
10 sec. max  
1min  
Wave  
Cooling  
Natural cooling in air is preferred, as this minimizes stresses  
within the soldered joint. When forced air cooling is used,  
cooling rate should not exceed 4°C/second. Quenching  
is not recommended but if used, maximum temperature  
differentials should be observed according to the preheat  
conditions above.  
300  
Preheat  
Natural  
Cooling  
250  
200  
150  
100  
50  
T
230°C  
to  
Cleaning  
250°C  
Flux residues may be hygroscopic or acidic and must be  
removed. AVX MLC capacitors are acceptable for use with  
all of the solvents described in the specifications MIL-STD-  
202 and EIA-RS-198. Alcohol based solvents are acceptable  
and properly controlled water cleaning systems are also  
acceptable. Many other solvents have been proven successful,  
and most solvents that are acceptable to other components  
on circuit assemblies are equally acceptable for use with  
ceramic capacitors.  
0
1 to 2 min  
3 sec. max  
(Preheat chips before soldering)  
T/maximum 150°C  
58  
1...151617181920

中文翻译

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