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06F9758 PDF预览

06F9758

更新时间: 2024-09-16 23:16:59
品牌 Logo 应用领域
其他 - ETC 肖特基二极管
页数 文件大小 规格书
6页 109K
描述
DIODE SCHOTTKY 2X10A

06F9758 数据手册

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Order this document  
by MBRB2060CT/D  
SEMICONDUCTOR TECHNICAL DATA  
2
D PAK Surface Mount Power Package  
Motorola Preferred Device  
Employs the use of the Schottky Barrier principle with a platinum barrier metal.  
These state–of–the–art devices have the following features:  
Package Designed for Power Surface Mount Applications  
Center–Tap Configuration  
Guardring for Stress Protection  
Low Forward Voltage  
150°C Operating Junction Temperature  
SCHOTTKY BARRIER  
RECTIFIER  
20 AMPERES  
60 VOLTS  
Epoxy Meets UL94, V at 1/8″  
O
Guaranteed Reverse Avalanche  
Short Heat Sink Tab Manufactured — Not Sheared!  
Similar in Size to Industry Standard TO–220 Package  
4
1
3
4
Mechanical Characteristics  
1
Case: Epoxy, Molded  
Weight: 1.7 grams (approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal Leads are  
Readily Solderable  
3
CASE 418B–02  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
Shipped 50 units per plastic tube  
Available in 24 mm Tape and Reel, 800 units per 13reel by adding a “T4”  
suffix to the part number  
Marking: B2060T  
MAXIMUM RATINGS, PER LEG  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
60  
Volts  
RRM  
RWM  
R
V
Average Rectified Forward Current  
I
10  
20  
Amps  
Amps  
Amps  
F(AV)  
(Rated V ) T = 110°C  
Total Device  
R
C
Peak Repetitive Forward Current  
I
20  
FRM  
(Rated V , Square Wave, 20 kHz), T = 100°C  
R
C
Non-repetitive Peak Surge Current  
I
150  
FSM  
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)  
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)  
Storage Temperature  
I
0.5  
Amp  
°C  
RRM  
T
stg  
65 to +175  
65 to +150  
10000  
Operating Junction Temperature  
T
J
°C  
Voltage Rate of Change (Rated V )  
R
dv/dt  
V/µs  
THERMAL CHARACTERISTICS, PER LEG  
Thermal Resistance — Junction to Case  
— Junction to Ambient (1)  
R
θJC  
R
θJA  
2.0  
50  
°C/W  
(1) See Chapter 7 for mounting conditions  
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.  
Thermal Clad is a trademark of the Bergquist Company  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Rev 1  
Motorola, Inc. 1996  

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