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Z515

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Z515 数据手册

Thermal Specifications and Design Considerations

The processor implements a bidirectional PROCHOT# capability to allow system

designs to protect various components from overheating situations. The PROCHOT#

signal is bidirectional in that it can either signal when the processor has reached its

maximum operating temperature or be driven from an external source to activate the

TCC. The ability to activate the TCC using PROCHOT# can provide a means for thermal

protection of system components.

Only a single PROCHOT# pin exists at a package level of the processor. When the

core's thermal sensor trips, the PROCHOT# signal is driven by the processor package.

If only TM1 is enabled, PROCHOT# will be asserted and only the core that is above

TCC temperature trip point will have its core clocks modulated. If TM2 is enabled and

the core is above TCC temperature trip point, it will enter the lowest programmed TM2

performance state. It is important to note that Intel recommends both TM1 and TM2

to be enabled.

When PROCHOT# is driven by an external agent, if only TM1 is enabled on the core,

then the processor core will have the clocks modulated. If TM2 is enabled, then the

processor core will enter the lowest programmed TM2 performance state. It should be

noted that Force TM1 on TM2, enabled using BIOS, does not have any effect on

external PROCHOT#. If PROCHOT# is driven by an external agent when TM1, TM2,

and Force TM1 on TM2 are all enabled, then the processor will still apply only TM2.

PROCHOT# may be used for thermal protection of voltage regulators (VR). System

designers can create a circuit to monitor the VR temperature and activate the TCC

when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low)

and activating the TCC, the VR will cool down as a result of reduced processor power

consumption. Bidirectional PROCHOT# can allow VR thermal designs to target

maximum sustained current instead of maximum current. Systems should still provide

proper cooling for the VR and rely on bidirectional PROCHOT# only as a backup in

case of system cooling failure. The system thermal design should allow the power

delivery circuitry to operate within its temperature specification even while the

processor is operating at its TDP. With a properly designed and characterized thermal

solution, it is anticipated that bidirectional PROCHOT# would only be asserted for very

short periods of time when running the most power intensive applications. An under-

designed thermal solution that is not able to prevent excessive assertion of

PROCHOT# in the anticipated ambient environment may cause a noticeable

performance loss.

Datasheet

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