是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | QFP | 包装说明: | QFP, |
针数: | 80 | Reach Compliance Code: | unknown |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.64 |
地址总线宽度: | 16 | 边界扫描: | NO |
最大时钟频率: | 20 MHz | 通信协议: | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP |
数据编码/解码方法: | NRZ; NRZB; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | 最大数据传输速率: | 2.5 MBps |
外部数据总线宽度: | 16 | JESD-30 代码: | R-PQFP-G80 |
JESD-609代码: | e3 | 长度: | 20 mm |
低功率模式: | NO | 串行 I/O 数: | 1 |
端子数量: | 80 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | QFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 峰值回流温度(摄氏度): | 225 |
认证状态: | Not Qualified | 座面最大高度: | 3.1 mm |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN | 端子形式: | GULL WING |
端子节距: | 0.8 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 14 mm |
uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | Base Number Matches: | 1 |
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