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Z0103MARL1G PDF预览

Z0103MARL1G

更新时间: 2024-02-01 04:49:39
品牌 Logo 应用领域
安森美 - ONSEMI 可控硅
页数 文件大小 规格书
10页 190K
描述
Sensitive Gate Triacs Series Silicon Bidirectional Thyristors

Z0103MARL1G 数据手册

 浏览型号Z0103MARL1G的Datasheet PDF文件第4页浏览型号Z0103MARL1G的Datasheet PDF文件第5页浏览型号Z0103MARL1G的Datasheet PDF文件第6页浏览型号Z0103MARL1G的Datasheet PDF文件第7页浏览型号Z0103MARL1G的Datasheet PDF文件第9页浏览型号Z0103MARL1G的Datasheet PDF文件第10页 
Z0103MA, Z0107MA, Z0109MA  
TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL  
H2A  
H2A  
H2B  
H2B  
H
W2  
H4  
H5  
T1  
L1  
H1  
W1  
W
L
T
T2  
F1  
F2  
D
P2  
P1  
P2  
P
Figure 12. Device Positioning on Tape  
Specification  
Millimeter  
Inches  
Min  
Max  
0.1653  
0.020  
0.110  
0.156  
0.3741  
0.039  
0.051  
0.768  
0.649  
0.433  
Min  
3.8  
0.38  
2.4  
1.5  
8.5  
0
Max  
4.2  
Symbol  
D
Item  
Tape Feedhole Diameter  
0.1496  
0.015  
0.0945  
0.059  
0.3346  
0
D2  
F1, F2  
H
Component Lead Thickness Dimension  
Component Lead Pitch  
0.51  
2.8  
Bottom of Component to Seating Plane  
Feedhole Location  
4.0  
H1  
H2A  
H2B  
H4  
H5  
L
9.5  
Deflection Left or Right  
1.0  
Deflection Front or Rear  
0
0
1.0  
Feedhole to Bottom of Component  
Feedhole to Seating Plane  
Defective Unit Clipped Dimension  
Lead Wire Enclosure  
0.7086  
0.610  
0.3346  
0.09842  
0.4921  
0.2342  
0.1397  
0.06  
18  
19.5  
16.5  
11  
15.5  
8.5  
2.5  
12.5  
5.95  
3.55  
0.15  
L1  
P
Feedhole Pitch  
0.5079  
0.2658  
0.1556  
0.08  
12.9  
6.75  
3.95  
0.20  
1.44  
0.65  
19  
P1  
Feedhole Center to Center Lead  
First Lead Spacing Dimension  
Adhesive Tape Thickness  
Overall Taped Package Thickness  
Carrier Strip Thickness  
P2  
T
T1  
0.0567  
0.027  
0.7481  
0.2841  
0.01968  
T2  
0.014  
0.6889  
0.2165  
.0059  
0.35  
17.5  
5.5  
0.15  
W
Carrier Strip Width  
W1  
W2  
Adhesive Tape Width  
6.3  
Adhesive Tape Position  
0.5  
2. Maximum alignment deviation between leads not to be greater than 0.2 mm.  
3. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.  
4. Component lead to tape adhesion must meet the pull test requirements.  
5. Maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.  
6. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.  
7. No more than 1 consecutive missing component is permitted.  
8. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.  
9. Splices will not interfere with the sprocket feed holes.  
http://onsemi.com  
8

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